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Silicon wafer bonding technology : for VLSI and MEMS applications / edited by Subramanian S. Iyer and Andre J. Auberton-Hervé. - London : Institution of Electrical Engineers, c2002. - xxv, 149 p. : il. ; 26 cm. - EMIS processing series ; no. 1 . - EMIS processing series ; no. 1. .

Incluye referencias bibliográficas e índice.

ISBN: 0852960395

Subjects--Topical Terms:
Tecnología de silicio sobre aislante.
Circuitos integrados--Integración a gran escala.
Sistemas microelectromecánicos.
Silicon-on-insulator technology.
Integrated circuits--Very large scale integration.
Microelectromechanical systems.

LC Class. No.: TK7871.85 / S555 2002