MARC details
| 000 -LÍDER |
|---|
| fixed length control field |
04745nam a22004815i 4500 |
| 001 - NÚMERO DE CONTROL |
|---|
| control field |
u371485 |
| 003 - IDENTIFICADOR DEL NÚMERO DE CONTROL |
|---|
| control field |
SIRSI |
| 005 - FECHA Y HORA DE LA ULTIMA TRANSACCIÓN |
|---|
| control field |
20160812080131.0 |
| 007 - CAMPO FIJO DE DESCRIPCIÓN FIJA--INFORMACIÓN GENERAL |
|---|
| fixed length control field |
cr nn 008mamaa |
| 008 - ELEMENTOS DE LONGITUD FIJA -- INFORMACIÓN GENERAL |
|---|
| fixed length control field |
100721s2010 xxu| s |||| 0|eng d |
| 020 ## - NÚMERO INTERNACIONAL NORMALIZADO PARA LIBROS |
|---|
| International Standard Book Number |
9781441957191 |
| -- |
978-1-4419-5719-1 |
| 040 ## - FUENTE DE CATALOGACIÓN |
|---|
| Transcribing agency |
MX-MeUAM |
| 050 #4 - SIGNATURA TOPOGRÁFICA DE LA BIBLIOTECA DEL CONGRESO |
|---|
| Classification number |
TK7800-8360 |
| 050 #4 - SIGNATURA TOPOGRÁFICA DE LA BIBLIOTECA DEL CONGRESO |
|---|
| Classification number |
TK7874-7874.9 |
| 082 04 - NÚMERO DE CLASIFICACIÓN DECIMAL DEWEY |
|---|
| Classification number |
621.381 |
| Edition number |
23 |
| 100 1# - ASIENTO PRINCIPAL--NOMBRE PERSONAL |
|---|
| Personal name |
Fan, X.J. |
| Relator term |
editor. |
| 245 10 - MENCIÓN DE TITULO |
|---|
| Title |
Moisture Sensitivity of Plastic Packages of IC Devices |
| Medium |
[recurso electrónico] / |
| Statement of responsibility, etc. |
edited by X.J. Fan, E. Suhir. |
| 264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE |
|---|
| Place of production, publication, distribution, manufacture |
Boston, MA : |
| Name of producer, publisher, distributor, manufacturer |
Springer US : |
| -- |
Imprint: Springer, |
| Date of production, publication, distribution, manufacture, or copyright notice |
2010. |
| 300 ## - DESCRIPCIÓN FÍSICA |
|---|
| Extent |
XIV, 558p. |
| Other physical details |
online resource. |
| 336 ## - CONTENT TYPE |
|---|
| Content type term |
text |
| Content type code |
txt |
| Source |
rdacontent |
| 337 ## - MEDIA TYPE |
|---|
| Media type term |
computer |
| Media type code |
c |
| Source |
rdamedia |
| 338 ## - CARRIER TYPE |
|---|
| Carrier type term |
online resource |
| Carrier type code |
cr |
| Source |
rdacarrier |
| 347 ## - DIGITAL FILE CHARACTERISTICS |
|---|
| File type |
text file |
| Encoding format |
PDF |
| Source |
rda |
| 490 1# - MENCIÓN DE SERIE |
|---|
| Series statement |
Micro- and Opto-Electronic Materials, Structures, and Systems |
| 505 0# - NOTA DE CONTENIDO |
|---|
| Formatted contents note |
Fundamental Characteristics of Moisture Transport, Diffusion, and the Moisture-Induced Damages in Polymeric Materials in Electronic Packaging -- Mechanism of Moisture Diffusion, Hygroscopic Swelling, and Adhesion Degradation in Epoxy Molding Compounds -- Real-Time Characterization of Moisture Absorption and Desorption -- Modeling of Moisture Diffusion and Whole-Field Vapor Pressure in Plastic Packages of IC Devices -- Characterization of Hygroscopic Deformations by Moiré Interferometry -- Characterization of Interfacial Hydrothermal Strength of Sandwiched Assembly Using Photomechanics Measurement Techniques -- Hygroscopic Swelling of Polymeric Materials in Electronic Packaging: Characterization and Analysis -- Modeling of Moisture Diffusion and Moisture-Induced Stresses in Semiconductor and MEMS Packages -- Methodology for Integrated Vapor Pressure, Hygroswelling, and Thermo-mechanical Stress Modeling of IC Packages -- Failure Criterion for Moisture-Sensitive Plastic Packages of Integrated Circuit (IC) Devices: Application and Extension of the Theory of Thin Plates of Large Deflections -- Continuum Theory in Moisture-Induced Failures of Encapsulated IC Devices -- Mechanism-Based Modeling of Thermal- and Moisture-Induced Failure of IC Devices -- New Method for Equivalent Acceleration of IPC/JEDEC Moisture Sensitivity Levels -- Moisture Sensitivity Level (MSL) Capability of Plastic-Encapsulated Packages -- Hygrothermal Delamination Analysis of Quad Flat No-Lead (QFN) Packages -- Industrial Applications of Moisture-Related Reliability Problems -- Underfill Selection Against Moisture in Flip Chip BGA Packages -- Moisture Sensitivity Investigations of 3D Stacked-Die Chip-Scale Packages (SCSPs) -- Automated Simulation System of Moisture Diffusion and Hygrothermal Stress for Microelectronic Packaging -- Moisture-Driven Electromigrative Degradation in Microelectronic Packages -- Interfacial Moisture Diffusion: Molecular Dynamics Simulation and Experimental Evaluation. |
| 520 ## - NOTA DE RESUMEN, ETC. |
|---|
| Summary, etc. |
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: • Thorough exploration of moisture’s effects based on lectures and tutorials by the authors • Consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging • Emerging theories and cutting-edge industrial applications presented by the leading professionals in the field Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike. |
| 596 ## - |
|---|
| -- |
19 |
| 650 #0 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO |
|---|
| Topical term or geographic name as entry element |
Engineering. |
| 650 #0 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO |
|---|
| Topical term or geographic name as entry element |
Electronics. |
| 650 #0 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO |
|---|
| Topical term or geographic name as entry element |
Optical materials. |
| 650 14 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO |
|---|
| Topical term or geographic name as entry element |
Engineering. |
| 650 24 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO |
|---|
| Topical term or geographic name as entry element |
Electronics and Microelectronics, Instrumentation. |
| 650 24 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO |
|---|
| Topical term or geographic name as entry element |
Optical and Electronic Materials. |
| 650 24 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO |
|---|
| Topical term or geographic name as entry element |
Engineering, general. |
| 700 1# - ASIENTO SECUNDARIO - NOMBRE PERSONAL |
|---|
| Personal name |
Suhir, E. |
| Relator term |
editor. |
| 710 2# - ASIENTO SECUNDARIO - NOMBRE CORPORATIVO |
|---|
| Corporate name or jurisdiction name as entry element |
SpringerLink (Online service) |
| 773 0# - HOST ITEM ENTRY |
|---|
| Title |
Springer eBooks |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY |
|---|
| Relationship information |
Printed edition: |
| International Standard Book Number |
9781441957184 |
| 830 #0 - ASIENTO SECUNDARIO DE SERIE--TITULO UNIFORME |
|---|
| Uniform title |
Micro- and Opto-Electronic Materials, Structures, and Systems |
| 856 40 - LOCALIZACIÓN Y ACCESO ELECTRÓNICOS |
|---|
| Public note |
Libro electrónico |
| Uniform Resource Identifier |
<a href="http://148.231.10.114:2048/login?url=http://link.springer.com/book/10.1007/978-1-4419-5719-1">http://148.231.10.114:2048/login?url=http://link.springer.com/book/10.1007/978-1-4419-5719-1</a> |
| 942 ## - TIPO DE MATERIAL (KOHA) |
|---|
| Koha item type |
Libro Electrónico |
