3D Integration for NoC-based SoC Architectures (Registro nro. 199860)

MARC details
000 -LÍDER
fixed length control field 03187nam a22004695i 4500
001 - NÚMERO DE CONTROL
control field u371980
003 - IDENTIFICADOR DEL NÚMERO DE CONTROL
control field SIRSI
005 - FECHA Y HORA DE LA ULTIMA TRANSACCIÓN
control field 20160812080158.0
007 - CAMPO FIJO DE DESCRIPCIÓN FIJA--INFORMACIÓN GENERAL
fixed length control field cr nn 008mamaa
008 - ELEMENTOS DE LONGITUD FIJA -- INFORMACIÓN GENERAL
fixed length control field 101109s2011 xxu| s |||| 0|eng d
020 ## - NÚMERO INTERNACIONAL NORMALIZADO PARA LIBROS
International Standard Book Number 9781441976185
-- 978-1-4419-7618-5
040 ## - FUENTE DE CATALOGACIÓN
Transcribing agency MX-MeUAM
050 #4 - SIGNATURA TOPOGRÁFICA DE LA BIBLIOTECA DEL CONGRESO
Classification number TK7888.4
082 04 - NÚMERO DE CLASIFICACIÓN DECIMAL DEWEY
Classification number 621.3815
Edition number 23
100 1# - ASIENTO PRINCIPAL--NOMBRE PERSONAL
Personal name Sheibanyrad, Abbas.
Relator term editor.
245 10 - MENCIÓN DE TITULO
Title 3D Integration for NoC-based SoC Architectures
Medium [recurso electrónico] /
Statement of responsibility, etc. edited by Abbas Sheibanyrad, Frédéric Pétrot, Axel Jantsch.
264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE
Place of production, publication, distribution, manufacture New York, NY :
Name of producer, publisher, distributor, manufacturer Springer New York,
Date of production, publication, distribution, manufacture, or copyright notice 2011.
300 ## - DESCRIPCIÓN FÍSICA
Extent X, 278 p.
Other physical details online resource.
336 ## - CONTENT TYPE
Content type term text
Content type code txt
Source rdacontent
337 ## - MEDIA TYPE
Media type term computer
Media type code c
Source rdamedia
338 ## - CARRIER TYPE
Carrier type term online resource
Carrier type code cr
Source rdacarrier
347 ## - DIGITAL FILE CHARACTERISTICS
File type text file
Encoding format PDF
Source rda
490 1# - MENCIÓN DE SERIE
Series statement Integrated Circuits and Systems,
International Standard Serial Number 1558-9412
505 0# - NOTA DE CONTENIDO
Formatted contents note Three-Dimensional Integration of Integrated Circuits - an Introduction -- The Promises and Limitation of 3-D Integration -- Testing 3D Stacked ICs Containing Through-Silicon Vias -- Design and Computer Aided Design of 3DIC -- Physical Analysis of NoC Topologies for 3-D Integrated Systems -- Three-Dimensional Networks-on-Chip: Performance Evaluation -- Asynchronous 3D-NoCs -- Design of Application-Specific 3D Networks-on-Chip Architectures -- 3D Network on Chip Topology Synthesis: Designing Custom Topologies for Chip Stacks -- 3-D NoC on Inductive Wireless Interconnect -- Influence of Stacked 3D Memory/Cache architectures on GPUs.
520 ## - NOTA DE RESUMEN, ETC.
Summary, etc. Back Cover Copy SERIES: Integrated Circuits and Systems 3D-Integration for NoC-based SoC Architectures by: (Editors) Abbas Sheibanyrad Frédéric Petrot Axel Janstch This book investigates on the promises, challenges, and solutions for the 3D Integration (vertically stacking) of embedded systems connected via a network on a chip. It covers the entire architectural design approach for 3D-SoCs. 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures have emerged as topics critical for current R&D leading to a broad range of products. This book presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures. •Presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures; •Covers the entire architectural design approach for 3D-SoCs; •Includes state-of-the-art treatment of 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures.
596 ## -
-- 19
650 #0 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO
Topical term or geographic name as entry element Engineering.
650 #0 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO
Topical term or geographic name as entry element Software engineering.
650 #0 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO
Topical term or geographic name as entry element Systems engineering.
650 14 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO
Topical term or geographic name as entry element Engineering.
650 24 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO
Topical term or geographic name as entry element Circuits and Systems.
650 24 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO
Topical term or geographic name as entry element Software Engineering.
700 1# - ASIENTO SECUNDARIO - NOMBRE PERSONAL
Personal name Pétrot, Frédéric.
Relator term editor.
700 1# - ASIENTO SECUNDARIO - NOMBRE PERSONAL
Personal name Jantsch, Axel.
Relator term editor.
710 2# - ASIENTO SECUNDARIO - NOMBRE CORPORATIVO
Corporate name or jurisdiction name as entry element SpringerLink (Online service)
773 0# - HOST ITEM ENTRY
Title Springer eBooks
776 08 - ADDITIONAL PHYSICAL FORM ENTRY
Relationship information Printed edition:
International Standard Book Number 9781441976178
830 #0 - ASIENTO SECUNDARIO DE SERIE--TITULO UNIFORME
Uniform title Integrated Circuits and Systems,
International Standard Serial Number 1558-9412
856 40 - LOCALIZACIÓN Y ACCESO ELECTRÓNICOS
Public note Libro electrónico
Uniform Resource Identifier <a href="http://148.231.10.114:2048/login?url=http://link.springer.com/book/10.1007/978-1-4419-7618-5">http://148.231.10.114:2048/login?url=http://link.springer.com/book/10.1007/978-1-4419-7618-5</a>
942 ## - TIPO DE MATERIAL (KOHA)
Koha item type Libro Electrónico
Existencias
Estado de retiro Fuente de clasificación Colección Ubicación permanente Ubicación actual Fecha de ingreso Total Checkouts Signatura topográfica Código de barras Date last seen Número de copia Tipo de material
    Colección de Libros Electrónicos Biblioteca Electrónica Biblioteca Electrónica     TK7888.4 371980-2001 12/08/2016 1 Libro Electrónico

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