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001 - NÚMERO DE CONTROL |
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003 - IDENTIFICADOR DEL NÚMERO DE CONTROL |
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005 - FECHA Y HORA DE LA ULTIMA TRANSACCIÓN |
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20160812080158.0 |
007 - CAMPO FIJO DE DESCRIPCIÓN FIJA--INFORMACIÓN GENERAL |
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101109s2011 xxu| s |||| 0|eng d |
020 ## - NÚMERO INTERNACIONAL NORMALIZADO PARA LIBROS |
International Standard Book Number |
9781441976185 |
-- |
978-1-4419-7618-5 |
040 ## - FUENTE DE CATALOGACIÓN |
Transcribing agency |
MX-MeUAM |
050 #4 - SIGNATURA TOPOGRÁFICA DE LA BIBLIOTECA DEL CONGRESO |
Classification number |
TK7888.4 |
082 04 - NÚMERO DE CLASIFICACIÓN DECIMAL DEWEY |
Classification number |
621.3815 |
Edition number |
23 |
100 1# - ASIENTO PRINCIPAL--NOMBRE PERSONAL |
Personal name |
Sheibanyrad, Abbas. |
Relator term |
editor. |
245 10 - MENCIÓN DE TITULO |
Title |
3D Integration for NoC-based SoC Architectures |
Medium |
[recurso electrónico] / |
Statement of responsibility, etc. |
edited by Abbas Sheibanyrad, Frédéric Pétrot, Axel Jantsch. |
264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE |
Place of production, publication, distribution, manufacture |
New York, NY : |
Name of producer, publisher, distributor, manufacturer |
Springer New York, |
Date of production, publication, distribution, manufacture, or copyright notice |
2011. |
300 ## - DESCRIPCIÓN FÍSICA |
Extent |
X, 278 p. |
Other physical details |
online resource. |
336 ## - CONTENT TYPE |
Content type term |
text |
Content type code |
txt |
Source |
rdacontent |
337 ## - MEDIA TYPE |
Media type term |
computer |
Media type code |
c |
Source |
rdamedia |
338 ## - CARRIER TYPE |
Carrier type term |
online resource |
Carrier type code |
cr |
Source |
rdacarrier |
347 ## - DIGITAL FILE CHARACTERISTICS |
File type |
text file |
Encoding format |
PDF |
Source |
rda |
490 1# - MENCIÓN DE SERIE |
Series statement |
Integrated Circuits and Systems, |
International Standard Serial Number |
1558-9412 |
505 0# - NOTA DE CONTENIDO |
Formatted contents note |
Three-Dimensional Integration of Integrated Circuits - an Introduction -- The Promises and Limitation of 3-D Integration -- Testing 3D Stacked ICs Containing Through-Silicon Vias -- Design and Computer Aided Design of 3DIC -- Physical Analysis of NoC Topologies for 3-D Integrated Systems -- Three-Dimensional Networks-on-Chip: Performance Evaluation -- Asynchronous 3D-NoCs -- Design of Application-Specific 3D Networks-on-Chip Architectures -- 3D Network on Chip Topology Synthesis: Designing Custom Topologies for Chip Stacks -- 3-D NoC on Inductive Wireless Interconnect -- Influence of Stacked 3D Memory/Cache architectures on GPUs. |
520 ## - NOTA DE RESUMEN, ETC. |
Summary, etc. |
Back Cover Copy SERIES: Integrated Circuits and Systems 3D-Integration for NoC-based SoC Architectures by: (Editors) Abbas Sheibanyrad Frédéric Petrot Axel Janstch This book investigates on the promises, challenges, and solutions for the 3D Integration (vertically stacking) of embedded systems connected via a network on a chip. It covers the entire architectural design approach for 3D-SoCs. 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures have emerged as topics critical for current R&D leading to a broad range of products. This book presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures. •Presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures; •Covers the entire architectural design approach for 3D-SoCs; •Includes state-of-the-art treatment of 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures. |
596 ## - |
-- |
19 |
650 #0 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO |
Topical term or geographic name as entry element |
Engineering. |
650 #0 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO |
Topical term or geographic name as entry element |
Software engineering. |
650 #0 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO |
Topical term or geographic name as entry element |
Systems engineering. |
650 14 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO |
Topical term or geographic name as entry element |
Engineering. |
650 24 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO |
Topical term or geographic name as entry element |
Circuits and Systems. |
650 24 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO |
Topical term or geographic name as entry element |
Software Engineering. |
700 1# - ASIENTO SECUNDARIO - NOMBRE PERSONAL |
Personal name |
Pétrot, Frédéric. |
Relator term |
editor. |
700 1# - ASIENTO SECUNDARIO - NOMBRE PERSONAL |
Personal name |
Jantsch, Axel. |
Relator term |
editor. |
710 2# - ASIENTO SECUNDARIO - NOMBRE CORPORATIVO |
Corporate name or jurisdiction name as entry element |
SpringerLink (Online service) |
773 0# - HOST ITEM ENTRY |
Title |
Springer eBooks |
776 08 - ADDITIONAL PHYSICAL FORM ENTRY |
Relationship information |
Printed edition: |
International Standard Book Number |
9781441976178 |
830 #0 - ASIENTO SECUNDARIO DE SERIE--TITULO UNIFORME |
Uniform title |
Integrated Circuits and Systems, |
International Standard Serial Number |
1558-9412 |
856 40 - LOCALIZACIÓN Y ACCESO ELECTRÓNICOS |
Public note |
Libro electrónico |
Uniform Resource Identifier |
<a href="http://148.231.10.114:2048/login?url=http://link.springer.com/book/10.1007/978-1-4419-7618-5">http://148.231.10.114:2048/login?url=http://link.springer.com/book/10.1007/978-1-4419-7618-5</a> |
942 ## - TIPO DE MATERIAL (KOHA) |
Koha item type |
Libro Electrónico |