Power Distribution Networks with On-Chip Decoupling Capacitors (Registro nro. 199930)

MARC details
000 -LÍDER
fixed length control field 04834nam a22004935i 4500
001 - NÚMERO DE CONTROL
control field u372050
003 - IDENTIFICADOR DEL NÚMERO DE CONTROL
control field SIRSI
005 - FECHA Y HORA DE LA ULTIMA TRANSACCIÓN
control field 20160812080202.0
007 - CAMPO FIJO DE DESCRIPCIÓN FIJA--INFORMACIÓN GENERAL
fixed length control field cr nn 008mamaa
008 - ELEMENTOS DE LONGITUD FIJA -- INFORMACIÓN GENERAL
fixed length control field 101123s2011 xxu| s |||| 0|eng d
020 ## - NÚMERO INTERNACIONAL NORMALIZADO PARA LIBROS
International Standard Book Number 9781441978714
-- 978-1-4419-7871-4
040 ## - FUENTE DE CATALOGACIÓN
Transcribing agency MX-MeUAM
050 #4 - SIGNATURA TOPOGRÁFICA DE LA BIBLIOTECA DEL CONGRESO
Classification number TK7888.4
082 04 - NÚMERO DE CLASIFICACIÓN DECIMAL DEWEY
Classification number 621.3815
Edition number 23
100 1# - ASIENTO PRINCIPAL--NOMBRE PERSONAL
Personal name Jakushokas, Renatas.
Relator term author.
245 10 - MENCIÓN DE TITULO
Title Power Distribution Networks with On-Chip Decoupling Capacitors
Medium [recurso electrónico] /
Statement of responsibility, etc. by Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba, Selçuk Köse, Eby G. Friedman.
264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE
Place of production, publication, distribution, manufacture New York, NY :
Name of producer, publisher, distributor, manufacturer Springer New York,
Date of production, publication, distribution, manufacture, or copyright notice 2011.
300 ## - DESCRIPCIÓN FÍSICA
Extent XXV, 644 p.
Other physical details online resource.
336 ## - CONTENT TYPE
Content type term text
Content type code txt
Source rdacontent
337 ## - MEDIA TYPE
Media type term computer
Media type code c
Source rdamedia
338 ## - CARRIER TYPE
Carrier type term online resource
Carrier type code cr
Source rdacarrier
347 ## - DIGITAL FILE CHARACTERISTICS
File type text file
Encoding format PDF
Source rda
505 0# - NOTA DE CONTENIDO
Formatted contents note Introduction -- Inductive Properties of Electric Circuits -- Properties of On-Chip Inductive Current Loops -- Electromigration -- Scaling Trends of On-Chip Power Distribution Noise -- High Performance Power Distribution Systems -- On-Chip Power Distribution Networks -- Computer-Aided Design and Analysis -- Closed Form Expressions for Fast IR Drop Analysis -- Inductive Properties of On-Chip Power Distribution Grids -- Variation of Grid Inductance with Frequency -- Inductance/Area/Resistance Tradeoffs Inductance Model of Interdigitated Power and Ground Distribution Networks -- On-chip Power Noise Reduction Techniques in High Performance ICs -- Impedance/Noise Issues in On-Chip Power Distribution Networks -- Impedance Characteristics of Multi-Layer Grids -- Multi-Layer Interdigitated Power Distribution Networks -- Multiple On-Chip Power Supply Systems -- On-Chip Power Distribution Grids with Multiple Supply Voltages -- Background for Decoupling Capacitance -- Decoupling Capacitors for Multi-Voltage Power Distribution Systems -- Effective Radii of On-Chip Decoupling Capacitors -- Efficient Placement of Distributed On-Chip Decoupling Capacitors -- Simultaneous Co-Design of Distributed On-Chip Power Supplies and Decoupling Capacitors -- Conclusions.
520 ## - NOTA DE RESUMEN, ETC.
Summary, etc. Power Distribution Networks with On-Chip Decoupling Capacitors, 2nd edition is dedicated to distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. This book provides a broad and cohesive treatment of power distribution systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors. The book provides insight and intuition into the behavior and design of on-chip power distribution systems.    This book has four primary objectives. The first objective is to describe the impedance characteristics of the overall power distribution system, from the voltage regulator through the printed circuit board and package onto the integrated circuit to the terminals of the on-chip circuitry. The second objective is to discuss the inductive characteristics of on-chip power distribution grids and the related circuit behavior of these structures. The third objective is to present design methodologies for efficiently placing on-chip decoupling capacitors in nanoscale integrated circuits. Finally, the fourth objective is to suggest novel architectures for distributing power across an integrated circuit, as well as provide new methodologies to efficiently analyze and design on-chip power grids.   Organized into subareas to provide a more intuitive flow to the reader, this edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.
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650 #0 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO
Topical term or geographic name as entry element Engineering.
650 #0 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO
Topical term or geographic name as entry element Computer science.
650 #0 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO
Topical term or geographic name as entry element Electronics.
650 #0 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO
Topical term or geographic name as entry element Systems engineering.
650 14 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO
Topical term or geographic name as entry element Engineering.
650 24 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO
Topical term or geographic name as entry element Circuits and Systems.
650 24 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO
Topical term or geographic name as entry element Electronics and Microelectronics, Instrumentation.
650 24 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO
Topical term or geographic name as entry element Processor Architectures.
700 1# - ASIENTO SECUNDARIO - NOMBRE PERSONAL
Personal name Popovich, Mikhail.
Relator term author.
700 1# - ASIENTO SECUNDARIO - NOMBRE PERSONAL
Personal name Mezhiba, Andrey V.
Relator term author.
700 1# - ASIENTO SECUNDARIO - NOMBRE PERSONAL
Personal name Köse, Selçuk.
Relator term author.
700 1# - ASIENTO SECUNDARIO - NOMBRE PERSONAL
Personal name Friedman, Eby G.
Relator term author.
710 2# - ASIENTO SECUNDARIO - NOMBRE CORPORATIVO
Corporate name or jurisdiction name as entry element SpringerLink (Online service)
773 0# - HOST ITEM ENTRY
Title Springer eBooks
776 08 - ADDITIONAL PHYSICAL FORM ENTRY
Relationship information Printed edition:
International Standard Book Number 9781441978707
856 40 - LOCALIZACIÓN Y ACCESO ELECTRÓNICOS
Public note Libro electrónico
Uniform Resource Identifier <a href="http://148.231.10.114:2048/login?url=http://link.springer.com/book/10.1007/978-1-4419-7871-4">http://148.231.10.114:2048/login?url=http://link.springer.com/book/10.1007/978-1-4419-7871-4</a>
942 ## - TIPO DE MATERIAL (KOHA)
Koha item type Libro Electrónico
Existencias
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    Colección de Libros Electrónicos Biblioteca Electrónica Biblioteca Electrónica     TK7888.4 372050-2001 12/08/2016 1 Libro Electrónico

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