MARC details
| 000 -LÍDER |
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04535cam a2200589Mi 4500 |
| 001 - NÚMERO DE CONTROL |
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u380038 |
| 003 - IDENTIFICADOR DEL NÚMERO DE CONTROL |
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SIRSI |
| 005 - FECHA Y HORA DE LA ULTIMA TRANSACCIÓN |
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20160812084627.0 |
| 006 - ELEMENTOS DE LONGITUD FIJA - CARACTERÍSTICAS DE MATERIALES ADICIONALES - INFORMACIÓN GENERAL |
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m o d |
| 007 - CAMPO FIJO DE DESCRIPCIÓN FIJA--INFORMACIÓN GENERAL |
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cr cnu---unuuu |
| 008 - ELEMENTOS DE LONGITUD FIJA -- INFORMACIÓN GENERAL |
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140315s2014 enk o 000 0 eng d |
| 040 ## - FUENTE DE CATALOGACIÓN |
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| Original cataloging agency |
EBLCP |
| Language of cataloging |
eng |
| Description conventions |
pn |
| Transcribing agency |
EBLCP |
| Modifying agency |
OPELS |
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IDEBK |
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CDX |
| -- |
OCLCF |
| -- |
OCLCQ |
| 019 ## - |
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| -- |
872644590 |
| 020 ## - NÚMERO INTERNACIONAL NORMALIZADO PARA LIBROS |
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| International Standard Book Number |
9780128008195 |
| Qualifying information |
(electronic bk.) |
| 020 ## - NÚMERO INTERNACIONAL NORMALIZADO PARA LIBROS |
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| International Standard Book Number |
0128008199 |
| Qualifying information |
(electronic bk.) |
| 020 ## - NÚMERO INTERNACIONAL NORMALIZADO PARA LIBROS |
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| International Standard Book Number |
1306490383 |
| Qualifying information |
(ebk) |
| 020 ## - NÚMERO INTERNACIONAL NORMALIZADO PARA LIBROS |
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| International Standard Book Number |
9781306490382 |
| Qualifying information |
(ebk) |
| 020 ## - NÚMERO INTERNACIONAL NORMALIZADO PARA LIBROS |
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| Canceled/invalid ISBN |
9780128007471 |
| 029 1# - OTHER SYSTEM CONTROL NUMBER (OCLC) |
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| OCLC library identifier |
AU@ |
| System control number |
000052839832 |
| 029 1# - OTHER SYSTEM CONTROL NUMBER (OCLC) |
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| OCLC library identifier |
DEBSZ |
| System control number |
414272927 |
| 029 1# - OTHER SYSTEM CONTROL NUMBER (OCLC) |
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| OCLC library identifier |
CHVBK |
| System control number |
327764686 |
| 029 1# - OTHER SYSTEM CONTROL NUMBER (OCLC) |
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| OCLC library identifier |
CHBIS |
| System control number |
010295253 |
| 029 1# - OTHER SYSTEM CONTROL NUMBER (OCLC) |
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| OCLC library identifier |
NLGGC |
| System control number |
389707724 |
| 050 #4 - SIGNATURA TOPOGRÁFICA DE LA BIBLIOTECA DEL CONGRESO |
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| Classification number |
QA76.612 |
| Item number |
.R384 2014 |
| 082 04 - NÚMERO DE CLASIFICACIÓN DECIMAL DEWEY |
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| Classification number |
005.11 |
| 049 ## - LOCAL HOLDINGS (OCLC) |
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| Holding library |
TEFA |
| 100 1# - ASIENTO PRINCIPAL--NOMBRE PERSONAL |
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| Personal name |
Bernstein, Joseph. |
| 245 10 - MENCIÓN DE TITULO |
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| Title |
Reliability prediction from burn-in data fit to reliability models |
| Medium |
[recurso electrónico] / |
| Statement of responsibility, etc. |
Joseph B. Bernstein. |
| 260 ## - PUBLICACIÓN, DISTRIBUCIÓN, ETC. (PIE DE IMPRENTA) |
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| Place of publication, distribution, etc. |
London : |
| Name of publisher, distributor, etc. |
Academic Press, |
| Date of publication, distribution, etc. |
2014. |
| 300 ## - DESCRIPCIÓN FÍSICA |
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| Extent |
1 online resource (108 pages) |
| 336 ## - CONTENT TYPE |
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| Content type term |
text |
| Content type code |
txt |
| Source |
rdacontent |
| 337 ## - MEDIA TYPE |
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| Media type term |
computer |
| Media type code |
c |
| Source |
rdamedia |
| 338 ## - CARRIER TYPE |
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| Carrier type term |
online resource |
| Carrier type code |
cr |
| Source |
rdacarrier |
| 588 0# - SOURCE OF DESCRIPTION NOTE |
|---|
| Source of description note |
Print version record. |
| 505 0# - NOTA DE CONTENIDO |
|---|
| Formatted contents note |
Front Cover; Reliability Prediction from Burn-In Data Fit to Reliability Models; Copyright Page; Contents; Introduction; 1 Shortcut to Accurate Reliability Prediction; 1.1 Background of FIT; 1.2 Multiple Failure Mechanism Model; 1.3 Acceleration Factor; 1.4 New Proportionality Method; 1.5 Chip Designer; 1.6 System Designer; 2 M-HTOL Principles; 2.1 Constant Rate Assumption; 2.2 Reliability Criteria; 2.3 The Failure Rate Curve for Electronic Systems; 2.4 Reliability Testing; 2.5 Accelerated Testing; 3 Failure Mechanisms; 3.1 Time-Dependent Dielectric Breakdown. |
| 505 8# - NOTA DE CONTENIDO |
|---|
| Formatted contents note |
3.1.1 Early Models for Dielectric Breakdown3.1.2 Acceleration Factors; 3.1.3 Models for Ultrathin Dielectric Breakdown; 3.1.4 Statistical Model; 3.2 Hot Carrier Injection; 3.2.1 Hot Carrier Effects; 3.2.2 Acceleration Factor; 3.2.3 Statistical Models for HCI Lifetime; 3.2.4 Lifetime Sensitivity; 3.3 Negative Bias Temperature Instability; 3.3.1 Degradation Models; 3.3.2 Lifetime Models; 3.4 Electromigration; 3.4.1 Lifetime Prediction; 3.4.2 Lifetime Distribution Model; 3.4.3 Lifetime Sensitivity; 3.5 Soft Errors Due to Memory Alpha Particles; 4 New M-HTOL Approach. |
| 505 8# - NOTA DE CONTENIDO |
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| Formatted contents note |
4.1 Problematic Zero Failure Criteria4.2 Single Versus Multiple Competing Mechanisms; 4.3 AF Calculation; 4.3.1 TDDB, EM, and HCI Failure Rate Calculations under Single Failure Mechanism Assumption; 4.3.2 TDDB, EM, and HCI Failure Rate Calculations under Multiple Failure Mechanism Assumption; 4.4 Electronic System CFR Approximation/Justification; 4.4.1 Exponential Distribution; 4.4.2 The Reliability of Complex Systems; 4.4.3 Drenick's Theorem; 4.5 PoF-Based Circuits Reliability Prediction Methodology; 4.5.1 Methodology; 4.5.2 Assumptions; 4.5.3 Input Data; 4.5.4 Device Thermal Analysis. |
| 505 8# - NOTA DE CONTENIDO |
|---|
| Formatted contents note |
4.6 Cell Reliability Estimation4.6.1 ESF Evaluation; 4.6.2 Cell Reliability; 4.7 Chip Reliability Prediction; 4.7.1 Functional Block Reliability; 4.7.2 Power Network EM Estimation; 4.8 Matrix Method; Bibliography. |
| 520 ## - NOTA DE RESUMEN, ETC. |
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| Summary, etc. |
This work will educate chip and system designers on a method for accurately predicting circuit and system reliability in order to estimate failures that will occur in the field as a function of operating conditions at the chip level. This book will combine the knowledge taught in many reliability publications and illustrate how to use the knowledge presented by the semiconductor manufacturing companies in combination with the HTOL end-of-life testing that is currently performed by the chip suppliers as part of their standard qualification procedure and make accurate reliability predictions. |
| 596 ## - |
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| -- |
19 |
| 650 #0 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO |
|---|
| Topical term or geographic name as entry element |
Reliability (Engineering) |
| 650 #4 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO |
|---|
| Topical term or geographic name as entry element |
Constraint programming (Computer science) |
| 650 #4 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO |
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| Topical term or geographic name as entry element |
Database management. |
| 650 #4 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO |
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| Topical term or geographic name as entry element |
Logic programming. |
| 650 #7 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO |
|---|
| Topical term or geographic name as entry element |
Reliability (Engineering) |
| Source of heading or term |
fast |
| Authority record control number |
(OCoLC)fst01093646 |
| 655 #4 - |
|---|
| -- |
Electronic books. |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY |
|---|
| Relationship information |
Print version: |
| Main entry heading |
Bernstein, Joseph. |
| Title |
Reliability Prediction from Burn-In Data Fit to Reliability Models. |
| Place, publisher, and date of publication |
Burlington : Elsevier Science, 2014 |
| International Standard Book Number |
9780128007471 |
| 856 40 - LOCALIZACIÓN Y ACCESO ELECTRÓNICOS |
|---|
| Public note |
Libro electrónico |
| Materials specified |
ScienceDirect |
| Uniform Resource Identifier |
<a href="http://148.231.10.114:2048/login?url=http://www.sciencedirect.com/science/book/9780128007471">http://148.231.10.114:2048/login?url=http://www.sciencedirect.com/science/book/9780128007471</a> |
| 942 ## - TIPO DE MATERIAL (KOHA) |
|---|
| Koha item type |
Libro Electrónico |
