MARC details
000 -LIDER |
fixed length control field |
03870nam a22005535i 4500 |
001 - CONTROL NUMBER |
control field |
978-981-10-8884-1 |
003 - CONTROL NUMBER IDENTIFIER |
control field |
DE-He213 |
005 - DATE AND TIME OF LATEST TRANSACTION |
control field |
20210201191325.0 |
007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION |
fixed length control field |
cr nn 008mamaa |
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
fixed length control field |
180405s2018 si | s |||| 0|eng d |
020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
International Standard Book Number |
9789811088841 |
-- |
978-981-10-8884-1 |
050 #4 - LIBRARY OF CONGRESS CALL NUMBER |
Classification number |
TK7888.4 |
072 #7 - SUBJECT CATEGORY CODE |
Subject category code |
TJFC |
Source |
bicssc |
072 #7 - SUBJECT CATEGORY CODE |
Subject category code |
TEC008010 |
Source |
bisacsh |
072 #7 - SUBJECT CATEGORY CODE |
Subject category code |
TJFC |
Source |
thema |
082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER |
Classification number |
621.3815 |
Edition number |
23 |
100 1# - MAIN ENTRY--PERSONAL NAME |
Personal name |
Lau, John H. |
Relator term |
author. |
Relator code |
aut |
-- |
http://id.loc.gov/vocabulary/relators/aut |
245 10 - TITLE STATEMENT |
Title |
Fan-Out Wafer-Level Packaging |
Medium |
[electronic resource] / |
Statement of responsibility, etc. |
by John H. Lau. |
250 ## - EDITION STATEMENT |
Edition statement |
1st ed. 2018. |
264 #1 - |
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Singapore : |
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Springer Singapore : |
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Imprint: Springer, |
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2018. |
300 ## - PHYSICAL DESCRIPTION |
Extent |
XX, 303 p. 278 illus., 226 illus. in color. |
Other physical details |
online resource. |
336 ## - |
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text |
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txt |
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rdacontent |
337 ## - |
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computer |
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c |
-- |
rdamedia |
338 ## - |
-- |
online resource |
-- |
cr |
-- |
rdacarrier |
347 ## - |
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text file |
-- |
PDF |
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rda |
500 ## - GENERAL NOTE |
General note |
Acceso multiusuario |
505 0# - FORMATTED CONTENTS NOTE |
Formatted contents note |
Patent Issues of Fan-out Wafer-Level Packaging -- Flip Chip Technology vs. FOWLP -- Fan-In Wafer-Level Packaging vs. FOWLP -- Embedded Chip Packaging -- FOWLP: Chip-First and Die Face-Down -- FOWLP: Chip-First and Die Face-Up -- FOWLP: Chip-Last or RDL-First -- FOWLP: PoP with FOWLP -- Fan-Out Panel-Level Packaging (FOPLP) -- 3D Integration -- Heterogeneous Integration. |
520 ## - SUMMARY, ETC. |
Summary, etc. |
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple's iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP - such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. - are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP. |
541 ## - IMMEDIATE SOURCE OF ACQUISITION NOTE |
Owner |
UABC ; |
Method of acquisition |
Temporal ; |
Date of acquisition |
01/01/2021-12/31/2023. |
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
Término temático o nombre geográfico como elemento de entrada |
Electronic circuits. |
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
Término temático o nombre geográfico como elemento de entrada |
Nanotechnology. |
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
Término temático o nombre geográfico como elemento de entrada |
Optical materials. |
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
Término temático o nombre geográfico como elemento de entrada |
Electronic materials. |
650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM |
Término temático o nombre geográfico como elemento de entrada |
Circuits and Systems. |
-- |
https://scigraph.springernature.com/ontologies/product-market-codes/T24068 |
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
Término temático o nombre geográfico como elemento de entrada |
Nanotechnology and Microengineering. |
-- |
https://scigraph.springernature.com/ontologies/product-market-codes/T18000 |
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
Término temático o nombre geográfico como elemento de entrada |
Optical and Electronic Materials. |
-- |
https://scigraph.springernature.com/ontologies/product-market-codes/Z12000 |
710 2# - ADDED ENTRY--CORPORATE NAME |
Corporate name or jurisdiction name as entry element |
SpringerLink (Online service) |
773 0# - HOST ITEM ENTRY |
Title |
Springer Nature eBook |
776 08 - ADDITIONAL PHYSICAL FORM ENTRY |
Relationship information |
Printed edition: |
International Standard Book Number |
9789811088834 |
776 08 - ADDITIONAL PHYSICAL FORM ENTRY |
Relationship information |
Printed edition: |
International Standard Book Number |
9789811088858 |
776 08 - ADDITIONAL PHYSICAL FORM ENTRY |
Relationship information |
Printed edition: |
International Standard Book Number |
9789811342660 |
856 40 - ELECTRONIC LOCATION AND ACCESS |
Public note |
Libro electrónico |
Uniform Resource Identifier |
http://148.231.10.114:2048/login?url=https://doi.org/10.1007/978-981-10-8884-1 |
912 ## - |
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ZDB-2-ENG |
912 ## - |
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ZDB-2-SXE |
942 ## - ADDED ENTRY ELEMENTS (KOHA) |
Koha item type |
Libro Electrónico |