Electrical Conductive Adhesives with Nanotechnologies [recurso electrónico] / by Yi Li, Daniel Lu, C. P. Wong.
Tipo de material:
TextoEditor: Boston, MA : Springer US, 2010Descripción: XII, 437 p. online resourceTipo de contenido: text Tipo de medio: computer Tipo de portador: online resourceISBN: 9780387887838Tema(s): Engineering | Electronics | Systems engineering | Materials | Optical materials | Nanotechnology | Engineering | Electronics and Microelectronics, Instrumentation | Nanotechnology | Circuits and Systems | Optical and Electronic Materials | Materials Science, generalFormatos físicos adicionales: Printed edition:: Sin títuloClasificación CDD: 621.381 Clasificación LoC:TK7800-8360TK7874-7874.9Recursos en línea: Libro electrónico
| Tipo de ítem | Biblioteca actual | Colección | Signatura | Copia número | Estado | Fecha de vencimiento | Código de barras |
|---|---|---|---|---|---|---|---|
| Libro Electrónico | Biblioteca Electrónica | Colección de Libros Electrónicos | TK7800 -8360 (Browse shelf(Abre debajo)) | 1 | No para préstamo | 370324-2001 |
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| TK7800 -8360 Introductory MEMS | TK7800 -8360 MEMS Materials and Processes Handbook | TK7800 -8360 Multi-Wafer Rotating MEMS Machines | TK7800 -8360 Electrical Conductive Adhesives with Nanotechnologies | TK7800 -8360 The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects | TK7800 -8360 Strain Effect in Semiconductors | TK7800 -8360 Three Dimensional Integrated Circuit Design |
Nanotechnology -- Characterizations of Electrically Conductive Adhesives -- Isotropically Conductive Adhesives (ICAs) -- Anisotropically Conductive Adhesives/Films (ACA/ACF) -- Non-Conductive Adhesives/Films (NCA/NCF) -- Conductive Nano-Inks -- Intrinsically Conducting Polymers (ICPs) -- Future Trend of Conductive Adhesive Technology.
Electrical Conductive Adhesives with Nanotechnologies begins with an overview of electronic packaging, discussing the various electrical adhesive options currently available. The book focuses extensively on Electrically Conductive Adhesives (ECAs), as well as other adhesives such as lead-free soldering, Isotropically Conductive Adhesives (ICAs), Anisotropically Conductive Adhesives/Films (ACA/ACFs) and Nonconductive Adhesives/Films (NCA/NCFs). The authors also present examples of how conductive adhesives can be applied to nano techniques, while making important mentions of recent research and development breakthroughs in the fields. Drawing upon tireless research, years of theoretical development and practical experience, and utilizing numerous visual examples and illustrative applications, authors CP Wong, Yi Li and Daniel Lu cover electrically conductive adhesives in depth, while also describing: The electrical properties, thermal performance, bonding pressure, assembly and reliability of numerous types of electrically conductive adhesives The similarities and differences between lead-free soldering techniques and electrically conductive adhesives, while also discussing the advantages of ECAs. Insights into the future of nano ECAs, as well as projections of future industry trends. Electrical Conductive Adhesives with Nanotechnologies is a must-read for both researchers and active engineers in the electronic packaging field.
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