The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects [recurso electrónico] / edited by Günter Grossmann, Christian Zardini.
Tipo de material: TextoEditor: London : Springer London, 2011Descripción: VIII, 313 p. 202 illus., 22 illus. in color. online resourceTipo de contenido: text Tipo de medio: computer Tipo de portador: online resourceISBN: 9780857292360Tema(s): Engineering | System safety | Electronics | Optical materials | Surfaces (Physics) | Engineering | Electronics and Microelectronics, Instrumentation | Optical and Electronic Materials | Quality Control, Reliability, Safety and Risk | Characterization and Evaluation of MaterialsFormatos físicos adicionales: Printed edition:: Sin títuloClasificación CDD: 621.381 Clasificación LoC:TK7800-8360TK7874-7874.9Recursos en línea: Libro electrónicoTipo de ítem | Biblioteca actual | Colección | Signatura | Copia número | Estado | Fecha de vencimiento | Código de barras |
---|---|---|---|---|---|---|---|
Libro Electrónico | Biblioteca Electrónica | Colección de Libros Electrónicos | TK7800 -8360 (Browse shelf(Abre debajo)) | 1 | No para préstamo | 370524-2001 |
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TK7800 -8360 MEMS Materials and Processes Handbook | TK7800 -8360 Multi-Wafer Rotating MEMS Machines | TK7800 -8360 Electrical Conductive Adhesives with Nanotechnologies | TK7800 -8360 The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects | TK7800 -8360 Strain Effect in Semiconductors | TK7800 -8360 Three Dimensional Integrated Circuit Design | TK7800 -8360 RF and Microwave Microelectronics Packaging |
1. Deformation and Fatigue of Solders -- 2. Factors Affecting the Bulk Embrittlement of Pb-Free Solder Joints -- 3. Thermal Fatigue Analysis -- 4. Electrochemical Behavior of Solder Alloys -- 5. Void Formation by Kirkendall Effect in Solder Joints -- 6. Tin Whiskers -- 7. Electromigration in Solder Interconnects -- 8. Impact of Black Pad and Intermetallic Layers on the Risk for Fractures in Solder Joints to Electroless Nickel/Immersion Gold -- 9. Reliability of Electronic Assemblies under Mechanical Shock Loading -- 10. Impact of Humidity and Contamination on Surface Insulation Resistance and Electrochemical Migration -- 11. Lead Free and Other Process Effects on Conductive Anodic Filamentation (CAF) Resistance of Glass Reinforced Epoxy Laminates -- 12. PCB Delamination -- 13. Excessive Warpage of Large Packages during Reflow Soldering -- 14. Popcorn Cracking -- 15. Thermal Capability of Components.
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering. The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints. The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics.
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