RF and Microwave Microelectronics Packaging [recurso electrónico] / edited by Ken Kuang, Franklin Kim, Sean S. Cahill.
Tipo de material:
TextoEditor: Boston, MA : Springer US, 2010Descripción: XVI, 285 p. online resourceTipo de contenido: text Tipo de medio: computer Tipo de portador: online resourceISBN: 9781441909848Tema(s): Engineering | Microwaves | Electronics | Systems engineering | Engineering | Electronics and Microelectronics, Instrumentation | Microwaves, RF and Optical Engineering | Circuits and SystemsFormatos físicos adicionales: Printed edition:: Sin títuloClasificación CDD: 621.381 Clasificación LoC:TK7800-8360TK7874-7874.9Recursos en línea: Libro electrónico
| Tipo de ítem | Biblioteca actual | Colección | Signatura | Copia número | Estado | Fecha de vencimiento | Código de barras |
|---|---|---|---|---|---|---|---|
| Libro Electrónico | Biblioteca Electrónica | Colección de Libros Electrónicos | TK7800 -8360 (Browse shelf(Abre debajo)) | 1 | No para préstamo | 371221-2001 |
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| TK7800 -8360 The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects | TK7800 -8360 Strain Effect in Semiconductors | TK7800 -8360 Three Dimensional Integrated Circuit Design | TK7800 -8360 RF and Microwave Microelectronics Packaging | TK7800 -8360 Cellular Nanoscale Sensory Wave Computing | TK7800 -8360 Photonic Microresonator Research and Applications | TK7800 -8360 Moisture Sensitivity of Plastic Packages of IC Devices |
Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies -- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages -- Polymeric Microelectromechanical Millimeter Wave Systems -- Millimeter-Wave Chip-on-Board Integration and Packaging -- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules -- RF/Microwave Substrate Packaging Roadmap for Portable Devices -- Ceramic Systems in Package for RF and Microwave -- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications -- LTCC Substrates for RF/MW Application -- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging -- High Performance Microelectronics Packaging Heat Sink Materials -- Technology Research on AlN 3D MCM.
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also: Presents methods and techniques used for measuring and testing of the electronic materials properties. Engages in an in-depth discussion of ceramic materials for RF/MW packaging. Offers numerical simulation methods and techniques used in analysis of electronic devices and materials. Discusses thermal management issues for RF/MW packaging. Creates a RF/Microwave Packaging Roadmap for Portable Devices.
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