Reliability of Microtechnology [recurso electrónico] : Interconnects, Devices and Systems / by Johan Liu, Olli Salmela, Jussi Sarkka, James E. Morris, Per-Erik Tegehall, Cristina Andersson.
Tipo de material:
TextoEditor: New York, NY : Springer New York, 2011Edición: 1Descripción: XIII, 204 p. online resourceTipo de contenido: text Tipo de medio: computer Tipo de portador: online resourceISBN: 9781441957603Tema(s): Engineering | System safety | Electronics | Optical materials | Engineering | Electronics and Microelectronics, Instrumentation | Optical and Electronic Materials | Quality Control, Reliability, Safety and Risk | Nanotechnology and MicroengineeringFormatos físicos adicionales: Printed edition:: Sin títuloClasificación CDD: 621.381 Clasificación LoC:TK7800-8360TK7874-7874.9Recursos en línea: Libro electrónico
| Tipo de ítem | Biblioteca actual | Colección | Signatura | Copia número | Estado | Fecha de vencimiento | Código de barras |
|---|---|---|---|---|---|---|---|
| Libro Electrónico | Biblioteca Electrónica | Colección de Libros Electrónicos | TK7800 -8360 (Browse shelf(Abre debajo)) | 1 | No para préstamo | 371497-2001 |
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Introduction to Reliability and its Importance -- Reliability Metrology -- General Failure Mechanisms of Microsystems -- Solder and Conductive Adhesive Joint Reliability -- Accelerated Testing -- Reliability Design for Manufacturability -- Component Reliability -- System Level Reliability -- Reliability and Quality Management of Microsystem -- Experimental Tools for Reliability Analysis.
Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also: Discusses the general failure mechanisms of microsystems on a component level Offers comprehensive coverage of solder joint reliability at the microsystems level Analyzes?quality issues and manufacturing at the microsystems level Reliability of Microtechnology is an ideal volume for researchers and professional engineers working in reliability and manufacturing. The book also includes exercises and detailed solutions at the end of each chapter.
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