Silicon Carbide Microsystems for Harsh Environments [recurso electrónico] / by Muthu B.J. Wijesundara, Robert Azevedo.
Tipo de material: TextoSeries MEMS Reference Shelf ; 22Editor: New York, NY : Springer New York, 2011Descripción: XVI, 232 p. online resourceTipo de contenido: text Tipo de medio: computer Tipo de portador: online resourceISBN: 9781441971210Tema(s): Engineering | Electronics | Systems engineering | Engineering | Electronics and Microelectronics, Instrumentation | Circuits and Systems | Nanotechnology and MicroengineeringFormatos físicos adicionales: Printed edition:: Sin títuloClasificación CDD: 621.381 Clasificación LoC:TK7800-8360TK7874-7874.9Recursos en línea: Libro electrónicoTipo de ítem | Biblioteca actual | Colección | Signatura | Copia número | Estado | Fecha de vencimiento | Código de barras |
---|---|---|---|---|---|---|---|
Libro Electrónico | Biblioteca Electrónica | Colección de Libros Electrónicos | TK7800 -8360 (Browse shelf(Abre debajo)) | 1 | No para préstamo | 371831-2001 |
Navegando Biblioteca Electrónica Estantes, Código de colección: Colección de Libros Electrónicos Cerrar el navegador de estanterías (Oculta el navegador de estanterías)
TK7800 -8360 MEMS Reliability | TK7800 -8360 MEMS Linear and Nonlinear Statics and Dynamics | TK7800 -8360 Radioisotope Thin-Film Powered Microsystems | TK7800 -8360 Silicon Carbide Microsystems for Harsh Environments | TK7800 -8360 Microelectronic Test Structures for CMOS Technology | TK7800 -8360 Advances in Biomedical Sensing, Measurements, Instrumentation and Systems | TK7800 -8360 Electromechanical Systems in Microtechnology and Mechatronics |
Introduction to Harsh MEMs -- Silicon Carbide Processing -- Silicon Carbide Electronics -- Silicon Carbide MEMS Devices -- Silicon Carbide MEMs Device Packaging -- System Integration.
<p><em>Silicon Carbide Microsystems for Harsh Environments</em> reviews state-of-the-art Silicon Carbide (SiC) technologies that, when combined, create microsystems capable of surviving in harsh environments. Technological readiness of the system components, key issues when integrating these components into systems, and other hurdles in harsh environment operation are discussed at length. The authors use the SiC technology platform suite as the model platform for developing harsh environment Microsystems, and then detail the current status of the specific individual technologies (electronics, MEMS, packaging). Additionally, methods towards system level integration of components and key challenges are evaluated and discussed based on the current state of SiC materials processing and device technology. Issues such as temperature mismatch, process compatibility and temperature stability of individual components and how these issues manifest when building the system receive thorough investigation. This book also: </p> <ul> <li>Addresses the SiC platform for complete microsystems and goes beyond the individual device level</li> <li>Provides a comprehensive collection of SiC technologies information relevant to harsh environment microsystems</li> <li>Covers the challenges in combining SiC process and components to a microsystem</li> <li>Discusses power source and signal transmission issues in the context of the harsh environment application space </li> </ul> <p><em>Silicon Carbide Microsystems for Harsh Environments</em> not only reviews the state-of-the-art MEMS devices, but also provides a framework for the joining of electronics and MEMS along with packaging into usable harsh-environment-ready sensor modules.</p>
19