Ultra-thin Chip Technology and Applications [recurso electrónico] / edited by Joachim Burghartz.

Por: Burghartz, Joachim [editor.]Colaborador(es): SpringerLink (Online service)Tipo de material: Texto

TextoEditor: New York, NY : Springer New York : Imprint: Springer, 2011Descripción: XXII, 467p. 252 illus., 157 illus. in color. online resourceTipo de contenido: text Tipo de medio: computer Tipo de portador: online resourceISBN: 9781441972767Tema(s): Engineering | Computer aided design | Systems engineering | Engineering | Circuits and Systems | Computer-Aided Engineering (CAD, CAE) and DesignFormatos físicos adicionales: Printed edition:: Sin títuloClasificación CDD: 621.3815 Clasificación LoC:TK7888.4Recursos en línea: Libro electrónico Texto

Contenidos:

Fabrication technologies for ultra-thin chips -- Post-processing techniques and issues -- Properties of ultra-thin chips; Applications.

En: Springer eBooksResumen: Ultra-thin Chip Technology and Applications edited by: Joachim N. Burghartz Ultra-thin chip technology has the potential to provide solutions for overcoming bottlenecks in silicon technology and for leading to new applications. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, assembly, characterization, modeling and applications of ultra-thin chips. •Provides a comprehensive overview of the challenges in ultra-thin chip fabrication, post processing, properties and applications by leaders in the field sharing their newest results and ideas; •Compares strengths and weaknesses of three generic fabrication processes for ultra-thin chips; •Describes electronic, mechanical, optical, and thermal properties of ultra-thin chips that are different from those of conventional, thick chips; •Shows that thin chip technology and its applications represents a new paradigm in silicon technology.

Existencias ( 1 )
Notas de título ( 3 )

Existencias
Tipo de ítem	Biblioteca actual	Colección	Signatura	Copia número	Estado	Fecha de vencimiento	Código de barras
Libro Electrónico	Biblioteca Electrónica	Colección de Libros Electrónicos	TK7888.4 (Browse shelf(Abre debajo))	1	No para préstamo		371876-2001

Fabrication technologies for ultra-thin chips -- Post-processing techniques and issues -- Properties of ultra-thin chips; Applications.

Ultra-thin Chip Technology and Applications edited by: Joachim N. Burghartz Ultra-thin chip technology has the potential to provide solutions for overcoming bottlenecks in silicon technology and for leading to new applications. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, assembly, characterization, modeling and applications of ultra-thin chips. •Provides a comprehensive overview of the challenges in ultra-thin chip fabrication, post processing, properties and applications by leaders in the field sharing their newest results and ideas; •Compares strengths and weaknesses of three generic fabrication processes for ultra-thin chips; •Describes electronic, mechanical, optical, and thermal properties of ultra-thin chips that are different from those of conventional, thick chips; •Shows that thin chip technology and its applications represents a new paradigm in silicon technology.