Advances in CMP/polishing technologies for the manufacture of electronic devices [recurso electrónico] / edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa.
Tipo de material:
TextoDetalles de publicación: Oxford : William Andrew, 2012Edición: 1st edDescripción: 1 online resource (xii, 317 p.)ISBN: 9781437778595; 1437778593Tema(s): Electrolytic polishing | Grinding and polishing | Electrolytic polishing | Grinding and polishingGénero/Forma: Electronic books.Clasificación CDD: 671.7/2 Clasificación LoC:TS670 | .A386 2012ebRecursos en línea: Libro electrónico ScienceDirect
Resumen: CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R&D accessible to the wider engineering community.
| Tipo de ítem | Biblioteca actual | Colección | Signatura | Copia número | Estado | Fecha de vencimiento | Código de barras |
|---|---|---|---|---|---|---|---|
| Libro Electrónico | Biblioteca Electrónica | Colección de Libros Electrónicos | TS670 .A386 2012 EB (Browse shelf(Abre debajo)) | 1 | No para préstamo | 380627-2001 |
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R&D accessible to the wider engineering community.
Includes index.
19
