VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence [electronic resource] : 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16-18, 2023, Revised Extended Selected Papers / edited by Ibrahim (Abe) M. Elfadel, Lutfi Albasha.

Colaborador(es): Elfadel, Ibrahim (Abe) M [editor.] | Albasha, Lutfi [editor.] | SpringerLink (Online service)Tipo de material: TextoTextoSeries IFIP Advances in Information and Communication Technology ; 680Editor: Cham : Springer Nature Switzerland : Imprint: Springer, 2024Edición: 1st ed. 2024Descripción: XII, 320 p. 170 illus., 126 illus. in color. online resourceTipo de contenido: text Tipo de medio: computer Tipo de portador: online resourceISBN: 9783031709470Tema(s): Computer engineering | Computer networks  | Software engineering | Computers | Computer Engineering and Networks | Software Engineering | Computer HardwareFormatos físicos adicionales: Printed edition:: Sin título; Printed edition:: Sin título; Printed edition:: Sin títuloClasificación CDD: 621.39 | 004.6 Clasificación LoC:TK7885-7895TK5105.5-5105.9Recursos en línea: Libro electrónicoTexto
Contenidos:
Architectures -- Synthesis of SFQ Circuits with Compound Gates -- Architecture-Compiler Co-Design for ReRAM-based Multi-Core CIM Architectures -- A Leap of Confidence: A Write-Intensity aware Prudent Page Migration for Hybrid Memories -- Efficient Depth Optimization in Quantum Addition and Modular Arithmetic with Ling Structure -- Accelerators -- Exploring Constrained-Modulus Modular Multipliers for Improved Area, Power and Flexibility -- Accelerating Large Kernel Convolutions with Nested Winograd Transformation -- A Unified and Energy-Efficient Depthwise Separable Convolution Accelerator -- Resiliency and Robustness -- Analyzing the Reliability of TCUs Through Micro-architecture and Structural Evaluations for Two Real Number Formats -- Advanced Quality Assurance Platform for Robust Process Design Kits -- FPGA-Implementation Techniques to Efficiently Test Application Readiness of Mixed-Signal Products -- Radiation Tolerant 14T SRAM Cell for Avionics Applications -- 3.125GS/s, 4.9 ENOB, 109 fJ/Conversion Time-Domain ADC for Backplane Interconnect.-Security and Privacy -- Enhancing HW-SW Confidentiality Verification for Embedded Processors with SoftFlow's Advanced Memory Range Feature -- Confidential Inference in Decision Trees -- Enhancing the Security of IJTAG network using Inherently Secure SIB.
En: Springer Nature eBookResumen: This book contains revised and extended versions of a selection of papers presented at the 31st IFIP WG 10.5/IEEE International Conference on the theme of VLSI-SoC Innovations for Trustworthy Artificial Intelligence, VLSI-SoC 2023, held in Sharjah, United Arab Emirates, during October 16-18, 2023. The 15 full papers included in this volume were carefully revised and expanded from 77 papers submitted to the conference. This edited volume has been organized into four parts: architectures; accelerators; resiliency and robustness; and security and privacy - and is representing cutting-edge research at the forefront of VLSI technology.
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Architectures -- Synthesis of SFQ Circuits with Compound Gates -- Architecture-Compiler Co-Design for ReRAM-based Multi-Core CIM Architectures -- A Leap of Confidence: A Write-Intensity aware Prudent Page Migration for Hybrid Memories -- Efficient Depth Optimization in Quantum Addition and Modular Arithmetic with Ling Structure -- Accelerators -- Exploring Constrained-Modulus Modular Multipliers for Improved Area, Power and Flexibility -- Accelerating Large Kernel Convolutions with Nested Winograd Transformation -- A Unified and Energy-Efficient Depthwise Separable Convolution Accelerator -- Resiliency and Robustness -- Analyzing the Reliability of TCUs Through Micro-architecture and Structural Evaluations for Two Real Number Formats -- Advanced Quality Assurance Platform for Robust Process Design Kits -- FPGA-Implementation Techniques to Efficiently Test Application Readiness of Mixed-Signal Products -- Radiation Tolerant 14T SRAM Cell for Avionics Applications -- 3.125GS/s, 4.9 ENOB, 109 fJ/Conversion Time-Domain ADC for Backplane Interconnect.-Security and Privacy -- Enhancing HW-SW Confidentiality Verification for Embedded Processors with SoftFlow's Advanced Memory Range Feature -- Confidential Inference in Decision Trees -- Enhancing the Security of IJTAG network using Inherently Secure SIB.

This book contains revised and extended versions of a selection of papers presented at the 31st IFIP WG 10.5/IEEE International Conference on the theme of VLSI-SoC Innovations for Trustworthy Artificial Intelligence, VLSI-SoC 2023, held in Sharjah, United Arab Emirates, during October 16-18, 2023. The 15 full papers included in this volume were carefully revised and expanded from 77 papers submitted to the conference. This edited volume has been organized into four parts: architectures; accelerators; resiliency and robustness; and security and privacy - and is representing cutting-edge research at the forefront of VLSI technology.

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