TY  - BOOK
AU  - Iyer,Subramanian S.
AU  - Auberton-Hervé,Andre J.
ED  - Institution of Electrical Engineers.
ED  - INSPEC.
TI  - Silicon wafer bonding technology: for VLSI and MEMS applications 
T2  - EMIS processing series
SN  - 0852960395
AV  - TK7871.85 S555 2002
PY  - 2002///
CY  - London
PB  - Institution of Electrical Engineers
KW  - Tecnología de silicio sobre aislante
KW  - Circuitos integrados
KW  - Integración a gran escala
KW  - Sistemas microelectromecánicos
KW  - Silicon-on-insulator technology
KW  - Integrated circuits
KW  - Very large scale integration
KW  - Microelectromechanical systems
N1  - Incluye referencias bibliográficas e índice
UR  - http://www.loc.gov/catdir/toc/fy0705/2006284940.html
UR  - http://www.loc.gov/catdir/enhancements/fy0651/2006284940-d.html
ER  -