TY  - BOOK
AU  - Brown,William D.
AU  - Ulrich,Richard K.
TI  - Advanced electronic packaging
T2  - IEEE Press series on microelectronic systems
SN  - 0471466093
AV  - TK7874 A38 2006
PY  - 2006///
CY  - Hoboken, NJ, Piscataway, NJ
PB  - Wiley, IEEE
KW  - Microelectrónica
KW  - Embalaje
KW  - lemb
KW  - Microelectronic packaging
N1  - Previous ed.: New York: IEEE, 1999; Incluye referencias bibliográficas e índice
UR  - http://www.loc.gov/catdir/enhancements/fy0643/2006296582-b.html
UR  - http://www.loc.gov/catdir/enhancements/fy0643/2006296582-d.html
ER  -