TY  - BOOK
AU  - Harman,George G.
AU  - Harman,George G.
TI  - Wire bonding in microelectronics
SN  - 9780071476232
AV  - TK7836 H37 2010
PY  - 2010///
CY  - New York
PB  - McGraw-Hill
KW  - Unión de cables (Encapsulado electrónico)
KW  - Control de producción
KW  - Encapsulado electrónico
KW  - Confiabilidad
KW  - Defectos
KW  - Semiconductores
KW  - Fallas
KW  - lemb
KW  - Wire bonding (Electronic packaging)
KW  - Production control
KW  - Electronic packaging
KW  - Reliability
KW  - Defects
KW  - Semiconductors
KW  - Failures
N1  - Ed. rev. de: Reliability and yield problems of wire bonding in microelectronics. 1989
ER  -