TY  - BOOK
AU  - Kuang,Ken
AU  - Kim,Franklin
AU  - Cahill,Sean S.
ED  - SpringerLink (Online service)
TI  - RF and Microwave Microelectronics Packaging
SN  - 9781441909848
AV  - TK7800-8360 
U1  - 621.381 23
PY  - 2010///
CY  - Boston, MA
PB  - Springer US
KW  - Engineering
KW  - Microwaves
KW  - Electronics
KW  - Systems engineering
KW  - Electronics and Microelectronics, Instrumentation
KW  - Microwaves, RF and Optical Engineering
KW  - Circuits and Systems
N1  - Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies -- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages -- Polymeric Microelectromechanical Millimeter Wave Systems -- Millimeter-Wave Chip-on-Board Integration and Packaging -- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules -- RF/Microwave Substrate Packaging Roadmap for Portable Devices -- Ceramic Systems in Package for RF and Microwave -- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications -- LTCC Substrates for RF/MW Application -- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging -- High Performance Microelectronics Packaging Heat Sink Materials -- Technology Research on AlN 3D MCM
N2  - RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also: Presents methods and techniques used for measuring and testing of the electronic materials properties. Engages in an in-depth discussion of ceramic materials for RF/MW packaging. Offers numerical simulation methods and techniques used in analysis of electronic devices and materials. Discusses thermal management issues for RF/MW packaging. Creates a RF/Microwave Packaging Roadmap for Portable Devices
UR  - http://148.231.10.114:2048/login?url=http://link.springer.com/book/10.1007/978-1-4419-0984-8
ER  -