TY  - BOOK
AU  - Doi,Toshiro
AU  - Marinescu,Ioan D.
AU  - Kurokawa,Syuhei
TI  - Advances in CMP/polishing technologies for the manufacture of electronic devices
SN  - 9781437778595
AV  - TS670 .A386 2012eb
U1  - 671.7/2 23
PY  - 2012///
CY  - Oxford
PB  - William Andrew
KW  - Electrolytic polishing
KW  - Grinding and polishing
KW  - fast
KW  - Electronic books
N1  - Includes index
N2  - CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R&D accessible to the wider engineering community
UR  - http://148.231.10.114:2048/login?url=http://www.sciencedirect.com/science/book/9781437778595
ER  -