TY  - BOOK
AU  - Lau,John H.
ED  - SpringerLink (Online service)
TI  - Fan-Out Wafer-Level Packaging
SN  - 9789811088841
AV  - TK7888.4 
U1  - 621.3815 23
PY  - 2018///
CY  - Singapore
PB  - Springer Singapore, Imprint: Springer
KW  - Electronic circuits
KW  - Nanotechnology
KW  - Optical materials
KW  - Electronic materials
KW  - Circuits and Systems
KW  - Nanotechnology and Microengineering
KW  - Optical and Electronic Materials
N1  - Acceso multiusuario; Patent Issues of Fan-out Wafer-Level Packaging -- Flip Chip Technology vs. FOWLP -- Fan-In Wafer-Level Packaging vs. FOWLP -- Embedded Chip Packaging -- FOWLP: Chip-First and Die Face-Down -- FOWLP: Chip-First and Die Face-Up -- FOWLP: Chip-Last or RDL-First -- FOWLP: PoP with FOWLP -- Fan-Out Panel-Level Packaging (FOPLP) -- 3D Integration -- Heterogeneous Integration
N2  - This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple's iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP - such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. - are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP
UR  - http://148.231.10.114:2048/login?url=https://doi.org/10.1007/978-981-10-8884-1
ER  -