TY  - BOOK
AU  - Cheng,Jie
ED  - SpringerLink (Online service)
TI  - Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect 
T2  - Springer Theses, Recognizing Outstanding Ph.D. Research,
SN  - 9789811061653
AV  - TS1-2301 
U1  - 670 23
PY  - 2018///
CY  - Singapore
PB  - Springer Singapore, Imprint: Springer
KW  - Manufactures
KW  - Tribology
KW  - Corrosion and anti-corrosives
KW  - Coatings
KW  - Electronics
KW  - Microelectronics
KW  - Manufacturing, Machines, Tools, Processes
KW  - Tribology, Corrosion and Coatings
KW  - Electronics and Microelectronics, Instrumentation
N1  - Acceso multiusuario
N2  - This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research
UR  - http://148.231.10.114:2048/login?url=https://doi.org/10.1007/978-981-10-6165-3
ER  -