TY  - BOOK
AU  - Qu,Shichun
AU  - Liu,Yong
TI  - Wafer-level chip-scale packaging : : analog and power semiconductor applications 
SN  - 9781493915552
AV  - TK7874  Q8 2015
PY  - 2015///
CY  - New York
PB  - Springer, 
KW  - lemb
KW  - Microelectrónica
KW  - Circuitos integrados
ER  -