TY  - BOOK
AU  - Lau,John H.
ED  - SpringerLink (Online service)
TI  - Chiplet Design and Heterogeneous Integration Packaging
SN  - 9789811999178
AV  - TK7800-8360 
U1  - 621.381 23
PY  - 2023///
CY  - Singapore
PB  - Springer Nature Singapore, Imprint: Springer
KW  - Electronics
KW  - Electronic circuits
KW  - Microtechnology
KW  - Microelectromechanical systems
KW  - Electronics and Microelectronics, Instrumentation
KW  - Electronic Circuits and Systems
KW  - Microsystems and MEMS
N1  - Acceso multiusuario; State-of-the-Art of Advanced Packaging -- Chip Partition and Chip Split -- Multiple System and Heterogeneous Integration with TSV Interposers -- Multiple System and Heterogeneous Integration with TSV-Less Interposers -- Chiplets Lateral (Horizontal) Communications -- Cu-Cu Hybrid Bonding
N2  - The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc
UR  - http://libcon.rec.uabc.mx:2048/login?url=https://doi.org/10.1007/978-981-19-9917-8
ER  -