TY  - GEN
AU  - Li,Yan
AU  - Deepak,Goyal
TI  - 3D microelectronic packaging: from architectures to applications 
T2  - Springer series in advanced microelectronics
SN  - 9789811570926
AV  - TK7867  M5218 2021
PY  - 2021///
CY  - Singapur
PB  - Springer Nature, 
KW  - lemb
KW  - Biotecnología
KW  - Circuitos electrónicos
N1  - Incluye referencias bibliográficas (p. 615-617)
ER  -