TY  - BOOK
AU  - Su,Jianbo
AU  - Qiao,Xiuquan
ED  - SpringerLink (Online service)
TI  - Advances in Haptics and Virtual Reality: Proceedings of 2023 International Conference on Haptics and Virtual Reality 
T2  - Learning and Analytics in Intelligent Systems,
SN  - 9783031565212
AV  - TA345-345.5 
U1  - 620.00285 23
PY  - 2024///
CY  - Cham
PB  - Springer Nature Switzerland, Imprint: Springer
KW  - Engineering
KW  - Data processing
KW  - Computational intelligence
KW  - Engineering mathematics
KW  - Data Engineering
KW  - Computational Intelligence
KW  - Mathematical and Computational Engineering Applications
N2  - This book collects selected papers from the 2023 International Conference on Haptics and Virtual Reality (ICHVR 2023), held during December 15-17, 2023. ICHVR 2023 is organized by Southeast University (SEU), Shanghai Jiao Tong University (SJTU) and co-organized by the International Association of Electrical, Electronic and Energy Engineering (IAEEEE). This book gathers together latest findings and insightful ideas from innovative academics and experts in the field of Haptics, Virtual Reality, Human-Computer Interaction, Computer Vision, Computer Arts, Mobile Intelligent Device and Artificial Intelligent Algorithm. This book serves as a valuable resource for staying up-to-date with the state of the art in Haptics and Virtual Reality and serves as a catalyst for further advancements and innovation in these fields, which will provide unique perspectives for readers consisting of professionals, scientists, practitioners, researchers, and graduate students
UR  - http://libcon.rec.uabc.mx:2048/login?url=https://doi.org/10.1007/978-3-031-56521-2
ER  -