TY  - BOOK
AU  - Lau,John H.
ED  - SpringerLink (Online service)
TI  - Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
SN  - 9789819721405
AV  - TK7800-8360 
U1  - 621.381 23
PY  - 2024///
CY  - Singapore
PB  - Springer Nature Singapore, Imprint: Springer
KW  - Electronics
KW  - Solid state physics
KW  - Lasers
KW  - Optics
KW  - Electronics and Microelectronics, Instrumentation
KW  - Electronic Devices
KW  - Laser Technology
KW  - Optics and Photonics
N1  -  -- Flip Chip Technology -- Cu-Cu Hybrid Bonding -- Fan-In Technology -- Fan-Out Technology -- Chiplet Communications (Bridges) -- Co-Packaged Optics
N2  - This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics. The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc
UR  - http://libcon.rec.uabc.mx:2048/login?url=https://doi.org/10.1007/978-981-97-2140-5
ER  -