Heat Transfer and Pressure Drop in Flow Boiling in Microchannels [recurso electrónico] / by Sujoy Kumar Saha, Gian Piero Celata.

Por: Saha, Sujoy Kumar [author.]Colaborador(es): Celata, Gian Piero [author.] | SpringerLink (Online service)Tipo de material: TextoTextoSeries SpringerBriefs in Applied Sciences and TechnologyEditor: Cham : Springer International Publishing : Imprint: Springer, 2016Descripción: X, 55 p. 40 illus., 16 illus. in color. online resourceTipo de contenido: text Tipo de medio: computer Tipo de portador: online resourceISBN: 9783319202853Tema(s): Engineering | Fluids | Thermodynamics | Heat engineering | Heat transfer | Mass transfer | Fluid mechanics | Engineering | Engineering Thermodynamics, Heat and Mass Transfer | Engineering Fluid Dynamics | Fluid- and AerodynamicsFormatos físicos adicionales: Printed edition:: Sin títuloClasificación CDD: 621.4021 Clasificación LoC:TJ265QC319.8-338.5Recursos en línea: Libro electrónicoTexto
Contenidos:
1. Introduction -- 2. Significance of flow visualization in micro channels -- 3. Pressure Drop Studies -- 4. Conclusion and further research.
En: Springer eBooksResumen: This Brief addresses the phenomena of heat transfer and pressure drop in flow boiling in micro channels occurring in high heat flux electronic cooling. A companion edition in the Springer Brief Subseries on Thermal Engineering and Applied Science to ?Critical Heat Flux in Flow Boiling in Micro channels,? by the same author team, this volume is idea for professionals, researchers and graduate students concerned with electronic cooling.
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1. Introduction -- 2. Significance of flow visualization in micro channels -- 3. Pressure Drop Studies -- 4. Conclusion and further research.

This Brief addresses the phenomena of heat transfer and pressure drop in flow boiling in micro channels occurring in high heat flux electronic cooling. A companion edition in the Springer Brief Subseries on Thermal Engineering and Applied Science to ?Critical Heat Flux in Flow Boiling in Micro channels,? by the same author team, this volume is idea for professionals, researchers and graduate students concerned with electronic cooling.

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