3-Dimensional VLSI [recurso electrónico] : A 2.5-Dimensional Integration Scheme / by Yangdong Deng, Wojciech P. Maly.

Por: Deng, Yangdong [author.]Colaborador(es): Maly, Wojciech P [author.] | SpringerLink (Online service)Tipo de material: TextoTextoEditor: Berlin, Heidelberg : Springer Berlin Heidelberg, 2010Descripción: online resourceTipo de contenido: text Tipo de medio: computer Tipo de portador: online resourceISBN: 9783642041570Tema(s): Engineering | Systems engineering | Engineering | Circuits and SystemsFormatos físicos adicionales: Printed edition:: Sin títuloClasificación CDD: 621.3815 Clasificación LoC:TK7888.4Recursos en línea: Libro electrónicoTexto
Contenidos:
A Cost Comparison of VLSI Integration Schemes -- Design Case Studies -- An Automatic 2.5-D Layout Design Flow -- Floorplanning for 2.5-D Integration -- Placement for 2.5-D Integration -- A Road map of 2.5-D Integration -- Conclusion and Future Work.
En: Springer eBooksResumen: "3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D. Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA.
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Tipo de ítem Biblioteca actual Colección Signatura Copia número Estado Fecha de vencimiento Código de barras
Libro Electrónico Biblioteca Electrónica
Colección de Libros Electrónicos TK7888.4 (Browse shelf(Abre debajo)) 1 No para préstamo 373624-2001

A Cost Comparison of VLSI Integration Schemes -- Design Case Studies -- An Automatic 2.5-D Layout Design Flow -- Floorplanning for 2.5-D Integration -- Placement for 2.5-D Integration -- A Road map of 2.5-D Integration -- Conclusion and Future Work.

"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D. Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA.

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