Three Dimensional System Integration [recurso electrónico] : IC Stacking Process and Design / edited by Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic.

Por: Papanikolaou, Antonis [editor.]Colaborador(es): Soudris, Dimitrios [editor.] | Radojcic, Riko [editor.] | SpringerLink (Online service)Tipo de material: TextoTextoEditor: Boston, MA : Springer US, 2011Descripción: VIII, 246 p. online resourceTipo de contenido: text Tipo de medio: computer Tipo de portador: online resourceISBN: 9781441909626Tema(s): Architecture | Systems engineering | Architecture | Basics of Construction | Circuits and SystemsFormatos físicos adicionales: Printed edition:: Sin títuloClasificación CDD: 720 Clasificación LoC:NA2543.B84Recursos en línea: Libro electrónicoTexto
Contenidos:
The next step in system integration: the benefits of going 3-D -- Process technology for manufacturing Through-Silicon Vias (TSVs) -- Alternative 3D integration schemes -- Manufacturing issues in 3D stacked ICs -- TSV characterization -- Physical design of 3D stacked ICs -- DRAM on logic stacking -- 3D general purpose micro-processors -- 3D system design: a holistic design approach.
En: Springer eBooksResumen: Three Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides an overview of the entire trajectory from basic process technology issues to the design at the system level of three dimensionally integrated nano-electronic systems. Physical design and design at the architecture and system level are emphasized in this book, since the technology has matured to the point that these issues have become very important. This book is intended for an audience with a basic grasp of electrical engineering concepts including some familiarity with fabrication of semiconductor devices, Very Large Scale Integration (VLSI) and computer architecture. •Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her work; •Provides a high-level (tutorial-like) description of 3D system integration that will cover issues ranging from process technology and manufacturing of 3D systems to the design of 3D components and entire systems; •First book to offer not only a high-level view of the entire field of 3D integration, but also an understanding of the interactions between the various phases of design and manufacturing.
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Existencias
Tipo de ítem Biblioteca actual Colección Signatura Copia número Estado Fecha de vencimiento Código de barras
Libro Electrónico Biblioteca Electrónica
Colección de Libros Electrónicos NA2543 .B84 (Browse shelf(Abre debajo)) 1 No para préstamo 371216-2001

The next step in system integration: the benefits of going 3-D -- Process technology for manufacturing Through-Silicon Vias (TSVs) -- Alternative 3D integration schemes -- Manufacturing issues in 3D stacked ICs -- TSV characterization -- Physical design of 3D stacked ICs -- DRAM on logic stacking -- 3D general purpose micro-processors -- 3D system design: a holistic design approach.

Three Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides an overview of the entire trajectory from basic process technology issues to the design at the system level of three dimensionally integrated nano-electronic systems. Physical design and design at the architecture and system level are emphasized in this book, since the technology has matured to the point that these issues have become very important. This book is intended for an audience with a basic grasp of electrical engineering concepts including some familiarity with fabrication of semiconductor devices, Very Large Scale Integration (VLSI) and computer architecture. •Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her work; •Provides a high-level (tutorial-like) description of 3D system integration that will cover issues ranging from process technology and manufacturing of 3D systems to the design of 3D components and entire systems; •First book to offer not only a high-level view of the entire field of 3D integration, but also an understanding of the interactions between the various phases of design and manufacturing.

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