Constrained Deformation of Materials [recurso electrónico] : Devices, Heterogeneous Structures and Thermo-Mechanical Modeling / by Y.-L. Shen.

Por: Shen, Y.-L [author.]Colaborador(es): SpringerLink (Online service)Tipo de material: TextoTextoEditor: Boston, MA : Springer US : Imprint: Springer, 2010Descripción: IX, 281 p. online resourceTipo de contenido: text Tipo de medio: computer Tipo de portador: online resourceISBN: 9781441963123Tema(s): Engineering | Mechanics | Materials | Surfaces (Physics) | Engineering | Continuum Mechanics and Mechanics of Materials | Surfaces and Interfaces, Thin Films | MechanicsFormatos físicos adicionales: Printed edition:: Sin títuloClasificación CDD: 620.1 Clasificación LoC:TA405-409.3QA808.2Recursos en línea: Libro electrónicoTexto
Contenidos:
Mechanics Preliminaries -- Thin Continuous Films -- Patterned Films in Micro-devices -- Electronic Packaging Structures -- Heterogeneous Materials -- Challenges and Outlook.
En: Springer eBooksResumen: "Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling" presents an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems. Mechanical deformations in thin films and miniaturized materials, commonly found in microelectronic devices and packages, MEMS, nanostructures and composite and multi-phase materials, are heavily influenced by the external or internal physical confinement. A continuum mechanics-based approach is used, together with discussions on micro-mechanisms, to treat the subject in a systematic manner under the unified theme. Readers will find valuable information on the proper application of thermo-mechanics in numerical modeling as well as in the interpretation and prediction of physical material behavior, along with many case studies. Additionally, particular attention is paid to practical engineering relevance. Thus real-life reliability issues are discussed in detail to serve the needs of researchers and engineers alike.
Star ratings
    Valoración media: 0.0 (0 votos)
Existencias
Tipo de ítem Biblioteca actual Colección Signatura Copia número Estado Fecha de vencimiento Código de barras
Libro Electrónico Biblioteca Electrónica
Colección de Libros Electrónicos TA405 -409.3 (Browse shelf(Abre debajo)) 1 No para préstamo 371624-2001

Mechanics Preliminaries -- Thin Continuous Films -- Patterned Films in Micro-devices -- Electronic Packaging Structures -- Heterogeneous Materials -- Challenges and Outlook.

"Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling" presents an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems. Mechanical deformations in thin films and miniaturized materials, commonly found in microelectronic devices and packages, MEMS, nanostructures and composite and multi-phase materials, are heavily influenced by the external or internal physical confinement. A continuum mechanics-based approach is used, together with discussions on micro-mechanisms, to treat the subject in a systematic manner under the unified theme. Readers will find valuable information on the proper application of thermo-mechanics in numerical modeling as well as in the interpretation and prediction of physical material behavior, along with many case studies. Additionally, particular attention is paid to practical engineering relevance. Thus real-life reliability issues are discussed in detail to serve the needs of researchers and engineers alike.

19

Con tecnología Koha