| 000 | 01444cam a2200397 a 4500 | ||
|---|---|---|---|
| 001 | u311511 | ||
| 003 | SIRSI | ||
| 005 | 20160811210914.0 | ||
| 008 | 090611s2008 njuad fr 001 0 eng c | ||
| 010 | _a 2007017041 | ||
| 040 |
_aDLC _cDLC _dBTCTA _dBAKER _dYDXCP _dC#P _dUKM |
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| 020 | _a9780470083017 | ||
| 020 | _a0470083018 | ||
| 050 | 0 | 0 |
_aTK7874 _b.H794 2008 |
| 082 | 0 | 0 |
_a621.381 _222 |
| 050 | 0 |
_aTK7874 _bH88 2008 |
|
| 100 | 1 | _aHsu, Tai-Ran. | |
| 245 | 1 | 0 |
_aMEMS and microsystems : _bdesign, manufacture, and nanoscale engineering / _cTai-Ran Hsu. |
| 250 | _a2nd ed. | ||
| 260 |
_aHoboken, N. J. : _bJohn Wiley, _c2008. |
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| 300 |
_axxv, 550 p. : _bil., gráficos ; _c25 cm. |
||
| 504 | _aIncluye referencias bibliográficas (p. 509-521) e índice. | ||
| 650 | 7 |
_aMicroelectrónica. _2lemb |
|
| 650 | 4 | _aSistemas microelectromecánicos. | |
| 650 | 7 |
_aMicroelectrónica _xEmbalaje. _2lemb |
|
| 650 | 0 | _aMicroelectronics. | |
| 650 | 0 | _aMicroelectromechanical systems. | |
| 650 | 0 | _aMicroelectronic packaging. | |
| 856 | 4 | 1 |
_3Table of contents only _uhttp://www.loc.gov/catdir/toc/ecip0716/2007017041.html |
| 856 | 4 | 2 |
_3Publisher description _uhttp://www.loc.gov/catdir/enhancements/fy0741/2007017041-d.html |
| 856 | 4 | 2 |
_3Contributor biographical information _uhttp://www.loc.gov/catdir/enhancements/fy0806/2007017041-b.html |
| 596 | _a2 | ||
| 942 | _cLIBRO | ||
| 999 |
_c153880 _d153880 |
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