| 000 | 01344cam a2200349 a 4500 | ||
|---|---|---|---|
| 001 | u318262 | ||
| 003 | SIRSI | ||
| 005 | 20240920152729.0 | ||
| 008 | 100616s2006 njua fr 001 0 eng c | ||
| 020 | _a0471466093 | ||
| 020 | _a9780471466093 | ||
| 040 |
_aUKM _cUKM _dBAKER _dBGU _dDLC |
||
| 050 | 0 |
_aTK7874 _bA38 2006 |
|
| 245 | 0 | 0 |
_aAdvanced electronic packaging / _cedited by William D. Brown, Richard K. Ulrich. |
| 250 | _a2nd ed. | ||
| 260 |
_aHoboken, NJ : _bWiley ; _aPiscataway, NJ : _bIEEE, _cc2006. |
||
| 300 |
_axxvi, 812 p. : _bil. ; _c26 cm. |
||
| 490 | 1 | _aIEEE Press series on microelectronic systems | |
| 500 | _aPrevious ed.: New York: IEEE, 1999. | ||
| 504 | _aIncluye referencias bibliográficas e índice. | ||
| 590 | _aCveAsig: 36189; | ||
| 590 | _aProgEdu: 7006; 29003; | ||
| 590 | _aAresCon: INGENIERÍA.TECNOLOGÍA; | ||
| 650 | 7 |
_aMicroelectrónica _xEmbalaje. _2lemb |
|
| 650 | 0 | _aMicroelectronic packaging. | |
| 700 | 1 |
_aBrown, William D., _d1943-, _eed. |
|
| 700 | 1 |
_aUlrich, Richard K., _cPh.D., _eed. |
|
| 830 | 0 | _aIEEE Press series on microelectronic systems. | |
| 856 | 4 | 2 |
_3Contributor biographical information _uhttp://www.loc.gov/catdir/enhancements/fy0643/2006296582-b.html |
| 856 | 4 | 2 |
_3Publisher description _uhttp://www.loc.gov/catdir/enhancements/fy0643/2006296582-d.html |
| 942 | _cRES_ABS | ||
| 999 |
_c159935 _d159935 |
||