| 000 | 01108cam a2200313 a 4500 | ||
|---|---|---|---|
| 001 | u323914 | ||
| 003 | SIRSI | ||
| 005 | 20160812064837.0 | ||
| 008 | 101124s2004 gw a gr 001 0 eng c | ||
| 020 | _a3540210490 | ||
| 022 | _a0933033X | ||
| 040 |
_aDLC _cDLC _dDLC |
||
| 050 | 0 |
_aTK7871.85 _bW33 2004 |
|
| 245 | 0 | 0 |
_aWafer bonding : _bapplications and technology / _cM. Alexe, U. Gösele (eds.). |
| 260 |
_aBerlin : _bSpringer, _c2004. |
||
| 300 |
_axv, 499 p. : _bil. ; _c24 cm. |
||
| 490 | 0 |
_aSpringer series in materials science ; _v75 |
|
| 504 | _aIncluye referencias bibliográficas e índice. | ||
| 650 | 7 |
_aSemiconductores _xUnión. _elemb |
|
| 650 | 7 |
_aSemiconductores _xOblea (Electrónica). _2lemb |
|
| 650 | 0 |
_aSemiconductors _xBonding. |
|
| 650 | 0 | _aSemiconductor wafers. | |
| 700 | 1 |
_aAlexe, M. _q(Marin), _eed. |
|
| 700 | 1 |
_aGösele, U., _eed. |
|
| 856 | 4 | 2 |
_3Publisher description _uhttp://www.loc.gov/catdir/enhancements/fy0817/2004046626-d.html |
| 856 | 4 | 1 |
_3Table of contents only _uhttp://www.loc.gov/catdir/enhancements/fy0817/2004046626-t.html |
| 596 | _a2 | ||
| 942 | _cRES_ABS | ||
| 999 |
_c165197 _d165197 |
||