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001			u370191
003			SIRSI
005			20160812080019.0
007			cr nn 008mamaa
008			110317s2011 xxu| s |||| 0|eng d
020			_a9780387473185 _9978-0-387-47318-5
040			_cMX-MeUAM
050		4	_aTK7800-8360
050		4	_aTK7874-7874.9
082	0	4	_a621.381 _223
100	1		_aGhodssi, Reza. _eeditor.
245	1	0	_aMEMS Materials and Processes Handbook _h[recurso electrónico] / _cedited by Reza Ghodssi, Pinyen Lin.
246	3		_aThe Handbook MEMs Materials and Processes offers a much more detailed treatment than the book by Leondes which is more general in its coverage and certainly less applied
264		1	_aBoston, MA : _bSpringer US : _bImprint: Springer, _c2011.
300			_aXXXVI, 1188 p. 200 illus. _bonline resource.
336			_atext _btxt _2rdacontent
337			_acomputer _bc _2rdamedia
338			_aonline resource _bcr _2rdacarrier
347			_atext file _bPDF _2rda
490	1		_aMEMS Reference Shelf, _x1936-4407 ; _v1
505	0		_aIntroduction – Reza Ghodssi and Pinyen Lin -- The MEMS Design Process – Tina Lamers and Beth Pruitt -- Additive Processes for Semiconductors and Dielectric Materials – Chris Zorman, Robert C. Roberts and Li Chen -- Additive Processes for Metals – David Arnold, Monika Saumer and Yong Kyu-Yoon -- Additive Processes for Polymeric Materials – Ellis Meng, Xin Zhang, and William Benard -- Additive Processes for Piezoelectric Materials – Ronald Polcawich, Jeff Pulskamp, Takashi Mineta, and Yoichi Haga -- Materials and Processes in Shape-Memory Alloy - Takashi Mineta and Yoichi Haga -- Dry Etching for Micromachining Applications – Srinivas Tadigadapa and Franz Laermer -- MEMS Wet-Etch Processes and Procedures – David Burns -- MEMS Lithography and Micromachining Techniques - Daniel Hines, Nathan Siwak, Lance Mosher and Reza Ghodssi -- Doping - Alan D. Raisanen -- Wafer Bonding – Shawn Cunningham and Mario Kupnik -- MEMS Packaging Materials – Ann Garrison Darrin and Robert Osiander -- Surface Treatment and Planarization – Pinyen Lin, Roya Maboudian, Carlo Carraro, Fan-Gang Tseng, Pen-Cheng Wang, and Yongqing Lan -- MEMS Process Integration – Michael Huff, Stephen Bart, and Pinyen Lin.              .
520			_aMEMS Materials and Processes Handbook is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on 'Materials' and 'Processes'. The extensive 'Material Selection Guide' and a 'Material Database' guides the reader through the selection of appropriate materials for the required task at hand. The 'Processes' section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs. The book also: Provides a comprehensive catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMS Discusses specific MEMS fabrication techniques such as additive, subtractive, and lithography/patterning, as well as wafer bonding, doping, surface treatment/preparation, and characterization techniques Provides the reader with a quick check list of the advantage/disadvantage of fabrication MEMS Material and Processes Handbook will be a valuable book for researchers, engineers and students working in MEMS and materials processing.
650		0	_aEngineering.
650		0	_aElectronics.
650		0	_aSystems engineering.
650		0	_aMaterials.
650		0	_aSurfaces (Physics).
650	1	4	_aEngineering.
650	2	4	_aElectronics and Microelectronics, Instrumentation.
650	2	4	_aMaterials Science, general.
650	2	4	_aCircuits and Systems.
650	2	4	_aSurfaces and Interfaces, Thin Films.
700	1		_aLin, Pinyen. _eeditor.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9780387473161
830		0	_aMEMS Reference Shelf, _x1936-4407 ; _v1
856	4	0	_zLibro electrónico _uhttp://148.231.10.114:2048/login?url=http://link.springer.com/book/10.1007/978-0-387-47318-5
596			_a19
942			_cLIBRO_ELEC
999			_c198071 _d198071