000 04131nam a22005175i 4500
001 u371082
003 SIRSI
005 20160812080108.0
007 cr nn 008mamaa
008 100301s2010 xxu| s |||| 0|eng d
020 _a9781441900401
_9978-1-4419-0040-1
040 _cMX-MeUAM
050 4 _aT174.7
050 4 _aTA418.9.N35
082 0 4 _a620.115
_223
100 1 _aWong, C.P.
_eeditor.
245 1 0 _aNano-Bio- Electronic, Photonic and MEMS Packaging
_h[recurso electrónico] /
_cedited by C.P. Wong, Kyoung-Sik Moon, Yi (Grace) Li.
250 _a1.
264 1 _aBoston, MA :
_bSpringer US,
_c2010.
300 _aXI, 761 p.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
505 0 _aNanomaterials for Microelectronic and Bio-packaging -- Nano-conductive Adhesives for Nano-electronics Interconnection -- Biomimetic Lotus Effect Surfaces for Nanopackaging -- Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materials -- Nanomaterials via NanoSpray Combustion Chemical Vapor Condensation, and Their Electronic Applications -- 1D Nanowire Electrode Materials for Power Sources of Microelectronics -- Mechanical Energy Harvesting Using Wurtzite Nanowires -- Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging -- to Nanoparticle-Based Integrated Passives -- Thermally Conductive Nanocomposites -- Physical Properties and Mechanical Behavior of Carbon Nano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC) Packages: Review and Extension -- On-Chip Thermal Management and Hot-Spot Remediation -- Some Aspects of Microchannel Heat Transfer -- Nanoprobes for Live-Cell Gene Detection -- Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips -- Packaging of Biomolecular and Chemical Microsensors -- Nanobiosensing Electronics and Nanochemistry for Biosensor Packaging -- Molecular Dynamics Applications in Packaging -- Nanoscale Deformation and Strain Analysis by AFM/DIC Technique -- Nano-Scale and Atomistic-Scale Modeling of Advanced Materials.
520 _aNanotechnologies are frequently being applied to the biotechnology area, especially in nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials at the device level. Nano-Bio- Electronic, Photonic and MEMS Packaging discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for bio devices and much more, including: Offering a comprehensive overview of nano and bio packaging Discussing nano materials as power energy sources Analyzing nanotubes, superhydrophobic self-clean Lotus surfaces Covering nano chemistry for bio sensor / bio medical device packaging Nano-Bio- Electronic, Photonic and MEMS Packaging is the perfect book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.
650 0 _aChemistry.
650 0 _aElectronics.
650 0 _aBiomedical engineering.
650 0 _aNanotechnology.
650 1 4 _aMaterials Science.
650 2 4 _aNanotechnology.
650 2 4 _aElectrochemistry.
650 2 4 _aElectronics and Microelectronics, Instrumentation.
650 2 4 _aBiomedical Engineering.
650 2 4 _aBiophysics and Biological Physics.
700 1 _aMoon, Kyoung-Sik.
_eeditor.
700 1 _aLi, Yi (Grace).
_eeditor.
710 2 _aSpringerLink (Online service)
773 0 _tSpringer eBooks
776 0 8 _iPrinted edition:
_z9781441900395
856 4 0 _zLibro electrónico
_uhttp://148.231.10.114:2048/login?url=http://link.springer.com/book/10.1007/978-1-4419-0040-1
596 _a19
942 _cLIBRO_ELEC
999 _c198962
_d198962