000 | 02667nam a22004215i 4500 | ||
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001 | u371876 | ||
003 | SIRSI | ||
005 | 20160812080153.0 | ||
007 | cr nn 008mamaa | ||
008 | 101118s2011 xxu| s |||| 0|eng d | ||
020 |
_a9781441972767 _9978-1-4419-7276-7 |
||
040 | _cMX-MeUAM | ||
050 | 4 | _aTK7888.4 | |
082 | 0 | 4 |
_a621.3815 _223 |
100 | 1 |
_aBurghartz, Joachim. _eeditor. |
|
245 | 1 | 0 |
_aUltra-thin Chip Technology and Applications _h[recurso electrónico] / _cedited by Joachim Burghartz. |
264 | 1 |
_aNew York, NY : _bSpringer New York : _bImprint: Springer, _c2011. |
|
300 |
_aXXII, 467p. 252 illus., 157 illus. in color. _bonline resource. |
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336 |
_atext _btxt _2rdacontent |
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337 |
_acomputer _bc _2rdamedia |
||
338 |
_aonline resource _bcr _2rdacarrier |
||
347 |
_atext file _bPDF _2rda |
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505 | 0 | _aFabrication technologies for ultra-thin chips -- Post-processing techniques and issues -- Properties of ultra-thin chips; Applications. | |
520 | _aUltra-thin Chip Technology and Applications edited by: Joachim N. Burghartz Ultra-thin chip technology has the potential to provide solutions for overcoming bottlenecks in silicon technology and for leading to new applications. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, assembly, characterization, modeling and applications of ultra-thin chips. •Provides a comprehensive overview of the challenges in ultra-thin chip fabrication, post processing, properties and applications by leaders in the field sharing their newest results and ideas; •Compares strengths and weaknesses of three generic fabrication processes for ultra-thin chips; •Describes electronic, mechanical, optical, and thermal properties of ultra-thin chips that are different from those of conventional, thick chips; •Shows that thin chip technology and its applications represents a new paradigm in silicon technology. | ||
650 | 0 | _aEngineering. | |
650 | 0 | _aComputer aided design. | |
650 | 0 | _aSystems engineering. | |
650 | 1 | 4 | _aEngineering. |
650 | 2 | 4 | _aCircuits and Systems. |
650 | 2 | 4 | _aComputer-Aided Engineering (CAD, CAE) and Design. |
710 | 2 | _aSpringerLink (Online service) | |
773 | 0 | _tSpringer eBooks | |
776 | 0 | 8 |
_iPrinted edition: _z9781441972750 |
856 | 4 | 0 |
_zLibro electrónico _uhttp://148.231.10.114:2048/login?url=http://link.springer.com/book/10.1007/978-1-4419-7276-7 |
596 | _a19 | ||
942 | _cLIBRO_ELEC | ||
999 |
_c199756 _d199756 |