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005 | 20160812084052.0 | ||
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008 | 110802s2011 xxu| s |||| 0|eng d | ||
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_a9781441998224 _9978-1-4419-9822-4 |
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040 | _cMX-MeUAM | ||
050 | 4 | _aT174.7 | |
050 | 4 | _aTA418.9.N35 | |
082 | 0 | 4 |
_a620.115 _223 |
100 | 1 |
_aZhou, Weilie. _eeditor. |
|
245 | 1 | 0 |
_aThree-Dimensional Nanoarchitectures _h[recurso electrónico] : _bDesigning Next-Generation Devices / _cedited by Weilie Zhou, Zhong Lin Wang. |
264 | 1 |
_aNew York, NY : _bSpringer New York : _bImprint: Springer, _c2011. |
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300 |
_aXVIII, 538p. 359 illus., 238 illus. in color. _bonline resource. |
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336 |
_atext _btxt _2rdacontent |
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337 |
_acomputer _bc _2rdamedia |
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338 |
_aonline resource _bcr _2rdacarrier |
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347 |
_atext file _bPDF _2rda |
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520 | _aDevices built from three-dimensional nanoarchitectures offer a number of advantages over those based on thin-film technology, such as larger surface area to enhance the sensitivity of sensors, to collect more sunlight to improve the efficiency of solar cells, and to supply higher density emitters for increased resolution in flat panel displays. Three-dimensional nanoscale assembly has already been used to generate many prototypes of devices and sensors, including piezoelectric nanogenerators based on ZnO nanowire arrays, photovoltaic devices based on silicon nanowire array p-n junctions, and highly sensitive gas sensors based on metal oxide nanowire arrays among others. Three-Dimensional Nanoarchitectures: Designing Next-Generation Devices describes state-of-the-art synthesis, integration, and design strategies used to create three-dimensional nanoarchitectures for functional nanodevice applications. With a focus on synthesis and fabrication methods for three-dimensional nanostructure assembly and construction, coverage includes resonators, nanophotonics, sensors, supercapacitors, solar cells, and more. This book is an essential reference for a broad audience of researchers in materials science, chemistry, physics, and electrical engineering who want the latest information on synthesis routes and assembly methods. Schematics of device integration and mechanisms as well as plots of measurement data are included. | ||
650 | 0 | _aNanochemistry. | |
650 | 0 | _aEngineering. | |
650 | 0 | _aComputer engineering. | |
650 | 0 | _aNanotechnology. | |
650 | 1 | 4 | _aMaterials Science. |
650 | 2 | 4 | _aNanotechnology. |
650 | 2 | 4 | _aNanotechnology and Microengineering. |
650 | 2 | 4 | _aCondensed Matter Physics. |
650 | 2 | 4 | _aNanochemistry. |
650 | 2 | 4 | _aElectrical Engineering. |
700 | 1 |
_aWang, Zhong Lin. _eeditor. |
|
710 | 2 | _aSpringerLink (Online service) | |
773 | 0 | _tSpringer eBooks | |
776 | 0 | 8 |
_iPrinted edition: _z9781441998217 |
856 | 4 | 0 |
_zLibro electrónico _uhttp://148.231.10.114:2048/login?url=http://link.springer.com/book/10.1007/978-1-4419-9822-4 |
596 | _a19 | ||
942 | _cLIBRO_ELEC | ||
999 |
_c200191 _d200191 |