000 04535cam a2200589Mi 4500
001 u380038
003 SIRSI
005 20160812084627.0
006 m o d
007 cr cnu---unuuu
008 140315s2014 enk o 000 0 eng d
040 _aEBLCP
_beng
_epn
_cEBLCP
_dOPELS
_dIDEBK
_dCDX
_dOCLCF
_dOCLCQ
019 _a872644590
020 _a9780128008195
_q(electronic bk.)
020 _a0128008199
_q(electronic bk.)
020 _a1306490383
_q(ebk)
020 _a9781306490382
_q(ebk)
020 _z9780128007471
029 1 _aAU@
_b000052839832
029 1 _aDEBSZ
_b414272927
029 1 _aCHVBK
_b327764686
029 1 _aCHBIS
_b010295253
029 1 _aNLGGC
_b389707724
050 4 _aQA76.612
_b.R384 2014
082 0 4 _a005.11
049 _aTEFA
100 1 _aBernstein, Joseph.
245 1 0 _aReliability prediction from burn-in data fit to reliability models
_h[recurso electrónico] /
_cJoseph B. Bernstein.
260 _aLondon :
_bAcademic Press,
_c2014.
300 _a1 online resource (108 pages)
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
588 0 _aPrint version record.
505 0 _aFront Cover; Reliability Prediction from Burn-In Data Fit to Reliability Models; Copyright Page; Contents; Introduction; 1 Shortcut to Accurate Reliability Prediction; 1.1 Background of FIT; 1.2 Multiple Failure Mechanism Model; 1.3 Acceleration Factor; 1.4 New Proportionality Method; 1.5 Chip Designer; 1.6 System Designer; 2 M-HTOL Principles; 2.1 Constant Rate Assumption; 2.2 Reliability Criteria; 2.3 The Failure Rate Curve for Electronic Systems; 2.4 Reliability Testing; 2.5 Accelerated Testing; 3 Failure Mechanisms; 3.1 Time-Dependent Dielectric Breakdown.
505 8 _a3.1.1 Early Models for Dielectric Breakdown3.1.2 Acceleration Factors; 3.1.3 Models for Ultrathin Dielectric Breakdown; 3.1.4 Statistical Model; 3.2 Hot Carrier Injection; 3.2.1 Hot Carrier Effects; 3.2.2 Acceleration Factor; 3.2.3 Statistical Models for HCI Lifetime; 3.2.4 Lifetime Sensitivity; 3.3 Negative Bias Temperature Instability; 3.3.1 Degradation Models; 3.3.2 Lifetime Models; 3.4 Electromigration; 3.4.1 Lifetime Prediction; 3.4.2 Lifetime Distribution Model; 3.4.3 Lifetime Sensitivity; 3.5 Soft Errors Due to Memory Alpha Particles; 4 New M-HTOL Approach.
505 8 _a4.1 Problematic Zero Failure Criteria4.2 Single Versus Multiple Competing Mechanisms; 4.3 AF Calculation; 4.3.1 TDDB, EM, and HCI Failure Rate Calculations under Single Failure Mechanism Assumption; 4.3.2 TDDB, EM, and HCI Failure Rate Calculations under Multiple Failure Mechanism Assumption; 4.4 Electronic System CFR Approximation/Justification; 4.4.1 Exponential Distribution; 4.4.2 The Reliability of Complex Systems; 4.4.3 Drenick's Theorem; 4.5 PoF-Based Circuits Reliability Prediction Methodology; 4.5.1 Methodology; 4.5.2 Assumptions; 4.5.3 Input Data; 4.5.4 Device Thermal Analysis.
505 8 _a4.6 Cell Reliability Estimation4.6.1 ESF Evaluation; 4.6.2 Cell Reliability; 4.7 Chip Reliability Prediction; 4.7.1 Functional Block Reliability; 4.7.2 Power Network EM Estimation; 4.8 Matrix Method; Bibliography.
520 _aThis work will educate chip and system designers on a method for accurately predicting circuit and system reliability in order to estimate failures that will occur in the field as a function of operating conditions at the chip level. This book will combine the knowledge taught in many reliability publications and illustrate how to use the knowledge presented by the semiconductor manufacturing companies in combination with the HTOL end-of-life testing that is currently performed by the chip suppliers as part of their standard qualification procedure and make accurate reliability predictions.
650 0 _aReliability (Engineering)
650 4 _aConstraint programming (Computer science)
650 4 _aDatabase management.
650 4 _aLogic programming.
650 7 _aReliability (Engineering)
_2fast
_0(OCoLC)fst01093646
655 4 _aElectronic books.
776 0 8 _iPrint version:
_aBernstein, Joseph.
_tReliability Prediction from Burn-In Data Fit to Reliability Models.
_dBurlington : Elsevier Science, 2014
_z9780128007471
856 4 0 _zLibro electrónico
_3ScienceDirect
_uhttp://148.231.10.114:2048/login?url=http://www.sciencedirect.com/science/book/9780128007471
596 _a19
942 _cLIBRO_ELEC
999 _c206959
_d206959