000 | 03870nam a22005535i 4500 | ||
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001 | 978-981-10-8884-1 | ||
003 | DE-He213 | ||
005 | 20210201191325.0 | ||
007 | cr nn 008mamaa | ||
008 | 180405s2018 si | s |||| 0|eng d | ||
020 |
_a9789811088841 _9978-981-10-8884-1 |
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050 | 4 | _aTK7888.4 | |
072 | 7 |
_aTJFC _2bicssc |
|
072 | 7 |
_aTEC008010 _2bisacsh |
|
072 | 7 |
_aTJFC _2thema |
|
082 | 0 | 4 |
_a621.3815 _223 |
100 | 1 |
_aLau, John H. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut |
|
245 | 1 | 0 |
_aFan-Out Wafer-Level Packaging _h[electronic resource] / _cby John H. Lau. |
250 | _a1st ed. 2018. | ||
264 | 1 |
_aSingapore : _bSpringer Singapore : _bImprint: Springer, _c2018. |
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300 |
_aXX, 303 p. 278 illus., 226 illus. in color. _bonline resource. |
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336 |
_atext _btxt _2rdacontent |
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337 |
_acomputer _bc _2rdamedia |
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338 |
_aonline resource _bcr _2rdacarrier |
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347 |
_atext file _bPDF _2rda |
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500 | _aAcceso multiusuario | ||
505 | 0 | _aPatent Issues of Fan-out Wafer-Level Packaging -- Flip Chip Technology vs. FOWLP -- Fan-In Wafer-Level Packaging vs. FOWLP -- Embedded Chip Packaging -- FOWLP: Chip-First and Die Face-Down -- FOWLP: Chip-First and Die Face-Up -- FOWLP: Chip-Last or RDL-First -- FOWLP: PoP with FOWLP -- Fan-Out Panel-Level Packaging (FOPLP) -- 3D Integration -- Heterogeneous Integration. | |
520 | _aThis comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple's iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP - such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. - are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP. | ||
541 |
_fUABC ; _cTemporal ; _d01/01/2021-12/31/2023. |
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650 | 0 | _aElectronic circuits. | |
650 | 0 | _aNanotechnology. | |
650 | 0 | _aOptical materials. | |
650 | 0 | _aElectronic materials. | |
650 | 1 | 4 |
_aCircuits and Systems. _0https://scigraph.springernature.com/ontologies/product-market-codes/T24068 |
650 | 2 | 4 |
_aNanotechnology and Microengineering. _0https://scigraph.springernature.com/ontologies/product-market-codes/T18000 |
650 | 2 | 4 |
_aOptical and Electronic Materials. _0https://scigraph.springernature.com/ontologies/product-market-codes/Z12000 |
710 | 2 | _aSpringerLink (Online service) | |
773 | 0 | _tSpringer Nature eBook | |
776 | 0 | 8 |
_iPrinted edition: _z9789811088834 |
776 | 0 | 8 |
_iPrinted edition: _z9789811088858 |
776 | 0 | 8 |
_iPrinted edition: _z9789811342660 |
856 | 4 | 0 |
_zLibro electrónico _uhttp://148.231.10.114:2048/login?url=https://doi.org/10.1007/978-981-10-8884-1 |
912 | _aZDB-2-ENG | ||
912 | _aZDB-2-SXE | ||
942 | _cLIBRO_ELEC | ||
999 |
_c242164 _d242163 |