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001 978-981-10-8884-1
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005 20210201191325.0
007 cr nn 008mamaa
008 180405s2018 si | s |||| 0|eng d
020 _a9789811088841
_9978-981-10-8884-1
050 4 _aTK7888.4
072 7 _aTJFC
_2bicssc
072 7 _aTEC008010
_2bisacsh
072 7 _aTJFC
_2thema
082 0 4 _a621.3815
_223
100 1 _aLau, John H.
_eauthor.
_4aut
_4http://id.loc.gov/vocabulary/relators/aut
245 1 0 _aFan-Out Wafer-Level Packaging
_h[electronic resource] /
_cby John H. Lau.
250 _a1st ed. 2018.
264 1 _aSingapore :
_bSpringer Singapore :
_bImprint: Springer,
_c2018.
300 _aXX, 303 p. 278 illus., 226 illus. in color.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
500 _aAcceso multiusuario
505 0 _aPatent Issues of Fan-out Wafer-Level Packaging -- Flip Chip Technology vs. FOWLP -- Fan-In Wafer-Level Packaging vs. FOWLP -- Embedded Chip Packaging -- FOWLP: Chip-First and Die Face-Down -- FOWLP: Chip-First and Die Face-Up -- FOWLP: Chip-Last or RDL-First -- FOWLP: PoP with FOWLP -- Fan-Out Panel-Level Packaging (FOPLP) -- 3D Integration -- Heterogeneous Integration.
520 _aThis comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple's iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP - such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. - are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.
541 _fUABC ;
_cTemporal ;
_d01/01/2021-12/31/2023.
650 0 _aElectronic circuits.
650 0 _aNanotechnology.
650 0 _aOptical materials.
650 0 _aElectronic materials.
650 1 4 _aCircuits and Systems.
_0https://scigraph.springernature.com/ontologies/product-market-codes/T24068
650 2 4 _aNanotechnology and Microengineering.
_0https://scigraph.springernature.com/ontologies/product-market-codes/T18000
650 2 4 _aOptical and Electronic Materials.
_0https://scigraph.springernature.com/ontologies/product-market-codes/Z12000
710 2 _aSpringerLink (Online service)
773 0 _tSpringer Nature eBook
776 0 8 _iPrinted edition:
_z9789811088834
776 0 8 _iPrinted edition:
_z9789811088858
776 0 8 _iPrinted edition:
_z9789811342660
856 4 0 _zLibro electrónico
_uhttp://148.231.10.114:2048/login?url=https://doi.org/10.1007/978-981-10-8884-1
912 _aZDB-2-ENG
912 _aZDB-2-SXE
942 _cLIBRO_ELEC
999 _c242164
_d242163