000 03865nam a22005535i 4500
001 978-3-319-69673-7
003 DE-He213
005 20210201191431.0
007 cr nn 008mamaa
008 171116s2018 gw | s |||| 0|eng d
020 _a9783319696737
_9978-3-319-69673-7
050 4 _aTK7888.4
072 7 _aTJFC
_2bicssc
072 7 _aTEC008010
_2bisacsh
072 7 _aTJFC
_2thema
082 0 4 _a621.3815
_223
100 1 _aSayil, Selahattin.
_eauthor.
_4aut
_4http://id.loc.gov/vocabulary/relators/aut
245 1 0 _aContactless VLSI Measurement and Testing Techniques
_h[electronic resource] /
_cby Selahattin Sayil.
250 _a1st ed. 2018.
264 1 _aCham :
_bSpringer International Publishing :
_bImprint: Springer,
_c2018.
300 _aV, 93 p. 34 illus., 11 illus. in color.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
500 _aAcceso multiusuario
505 0 _a1. Conventional Test Methods. - 2. Testability Design -- 3. Other Techniques Based on the Contacting Probe -- 4. Contactless Testing -- 5. Electron-Beam and Photoemission Probing -- 6. Electro Optic Sampling and Charge Density Probe -- 7. Electric Force Microscope, Capacitive Coupling and Scanning Magneto-Resistive Probe -- 8. Probing Techniques Based on Light Emission from Chip -- 9. All Silicon Optical Technology for Contactless Testing of Integrated Circuits -- 10. Comparison of Contactless Testing Methodologies.
520 _aThis book provides readers with a comprehensive overview of the state-of-the-art in optical contactless probing approaches, in order to fill a gap in the literature on VLSI Testing.  The author highlights the inherent difficulties encountered with the mechanical probe and testability design approaches for functional and internal fault testing and shows how contactless testing might resolve many of the challenges associated with conventional mechanical wafer testing. The techniques described in this book address the increasing demands for internal access of the logic state of a node within a chip under test: Provides a single-source reference on contactless probing approaches for VLSI testing and diagnostic measurement Introduces readers to various optical contactless testing techniques, such as Electro-Optic Probing, Charge Density Probe, and Photo-emissive Probe Discusses the applicability and adaptability of each technique, based on multilayer metallization, wafer level techniques, and invasiveness Provides a comparison among various contactless testing techniques Describes a variety of industrial applications of contactless VLSI testing.
541 _fUABC ;
_cTemporal ;
_d01/01/2021-12/31/2023.
650 0 _aElectronic circuits.
650 0 _aMicroprocessors.
650 0 _aElectronics.
650 0 _aMicroelectronics.
650 1 4 _aCircuits and Systems.
_0https://scigraph.springernature.com/ontologies/product-market-codes/T24068
650 2 4 _aProcessor Architectures.
_0https://scigraph.springernature.com/ontologies/product-market-codes/I13014
650 2 4 _aElectronics and Microelectronics, Instrumentation.
_0https://scigraph.springernature.com/ontologies/product-market-codes/T24027
710 2 _aSpringerLink (Online service)
773 0 _tSpringer Nature eBook
776 0 8 _iPrinted edition:
_z9783319696720
776 0 8 _iPrinted edition:
_z9783319696744
776 0 8 _iPrinted edition:
_z9783319888194
856 4 0 _zLibro electrónico
_uhttp://148.231.10.114:2048/login?url=https://doi.org/10.1007/978-3-319-69673-7
912 _aZDB-2-ENG
912 _aZDB-2-SXE
942 _cLIBRO_ELEC
999 _c243443
_d243442