| 000 | 00460nam a22001337a 4500 | ||
|---|---|---|---|
| 005 | 20240920163823.0 | ||
| 020 | _a9781138033566 | ||
| 245 |
_aModeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging / _cXing-Chang Wei |
||
| 260 |
_bCRC Press : Taylor & Francis Group, _c2017 |
||
| 590 | _aCveAsig: 36176; 36189; | ||
| 590 | _aProgEdu: 7006; 29003; | ||
| 590 | _aAresCon: INGENIERÍA.TECNOLOGÍA; | ||
| 999 |
_c257352 _d257351 |
||
| 942 | _6_ | ||