| 000 | 00386nam a22001337a 4500 | ||
|---|---|---|---|
| 005 | 20240923133353.0 | ||
| 020 | _a9781138075405 | ||
| 245 |
_aSemiconductor packaging : materials interaction and reliability / _cAndrea Chen, |
||
| 260 |
_bCRC Press, _c2011 |
||
| 590 | _aCveAsig: 36189; | ||
| 590 | _a¿ProgEdu: 7006; 29003; | ||
| 590 | _aAresCon: INGENIERÍA.TECNOLOGÍA; | ||
| 999 |
_c257770 _d257769 |
||
| 942 | _6_ | ||