000 00380nam a22001337a 4500
005 20240923133007.0
020 _a9783319445847
245 _a3D microelectronic packaging : from fundamentals to applications /
_cYan Li
260 _bSpringer,
_c 2017
590 _aCveAsig: 36189;
590 _aProgEdu: 7006; 29003;
590 _aAresCon: INGENIERÍA.TECNOLOGÍA;
999 _c257778
_d257777
942 _6_