| 000 | 00691nam a22002177a 4500 | ||
|---|---|---|---|
| 003 | MX-MeUAM | ||
| 005 | 20240917155901.0 | ||
| 008 | 240913s2015 nyua fr 000 0 eng d | ||
| 020 | _a9781493915552 | ||
| 020 | _a9781493915569 | ||
| 040 |
_bspa _cMX-MeUAM |
||
| 050 | 4 |
_aTK7874 _bQ8 2015 |
|
| 100 | 1 |
_935903 _aQu, Shichun |
|
| 245 | 1 | 0 |
_aWafer-level chip-scale packaging : _banalog and power semiconductor applications / _cShichun Qu, Yong Liu |
| 260 |
_aNew York : _bSpringer, _c2015 |
||
| 300 |
_a322 p. : _bil., algunas col. ; _c23 cm. |
||
| 650 | 7 |
_2lemb _aMicroelectrónica. |
|
| 650 | 7 |
_2lemb _aCircuitos integrados. |
|
| 700 | 1 |
_935904 _aLiu,Yong _ecoaut. |
|
| 942 | _cLIBRO | ||
| 999 |
_c257780 _d257779 |
||