| 000 | 01155 a2200325 4500 | ||
|---|---|---|---|
| 003 | MX-MeUAM | ||
| 005 | 20241111122134.0 | ||
| 008 | 240214s2011 xxu fr 001 0deng d | ||
| 020 | _a9780128103708 (rústica) | ||
| 040 |
_bspa _cMX-MeUAM |
||
| 050 | 4 |
_aTK7871 _bL52 2011 |
|
| 100 | 1 |
_aLicari, James J., _d1930- _932458 |
|
| 245 | 1 | 0 |
_aAdhesives technology for electronic applications : _bmaterials, processing, reliability / _cJames J. Licari, Dale W. Swanson |
| 250 | _a2nd ed. | ||
| 260 |
_aKidlington, Oxford : _bWilliam Andrew : _bElsevier, _c2011 |
||
| 300 |
_aviii, 403 p. : _bil. ; _c23 cm. |
||
| 490 | 0 | _aMaterials and processes for electronic applications series. | |
| 504 | _aIncluye referencias bibliográficas e índice. | ||
| 590 | _aCveAsig: 36178; | ||
| 590 | _aProgEdu: 7006; 29003; 33212; | ||
| 590 | _aAresCon: INGENIERÍA.TECNOLOGÍA; | ||
| 650 | 0 | _2Adhesives. | |
| 650 | 0 |
_aElectronics _xMaterials. |
|
| 650 | 0 | _aElectronic potting. | |
| 650 | 7 |
_2lemb _aAdhesivos. |
|
| 650 | 4 |
_aElectrónica _xMateriales. |
|
| 650 | 4 | _aEncapsulado electrónico. | |
| 700 | 1 |
_932462 _aSwanson, Dale W. _ecoaut. |
|
| 942 | _cLIBRO | ||
| 999 |
_c259251 _d259250 |
||