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001 978-981-19-9917-8
003 DE-He213
005 20240207153555.0
007 cr nn 008mamaa
008 230327s2023 si | s |||| 0|eng d
020 _a9789811999178
_9978-981-19-9917-8
050 4 _aTK7800-8360
072 7 _aTJF
_2bicssc
072 7 _aTEC008000
_2bisacsh
072 7 _aTJF
_2thema
082 0 4 _a621.381
_223
100 1 _aLau, John H.
_eauthor.
_4aut
_4http://id.loc.gov/vocabulary/relators/aut
245 1 0 _aChiplet Design and Heterogeneous Integration Packaging
_h[electronic resource] /
_cby John H. Lau.
250 _a1st ed. 2023.
264 1 _aSingapore :
_bSpringer Nature Singapore :
_bImprint: Springer,
_c2023.
300 _aXXII, 525 p. 543 illus., 501 illus. in color.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
500 _aAcceso multiusuario
505 0 _aState-of-the-Art of Advanced Packaging -- Chip Partition and Chip Split -- Multiple System and Heterogeneous Integration with TSV Interposers -- Multiple System and Heterogeneous Integration with TSV-Less Interposers -- Chiplets Lateral (Horizontal) Communications -- Cu-Cu Hybrid Bonding.
520 _aThe book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
541 _fUABC ;
_cPerpetuidad
650 0 _aElectronics.
650 0 _aElectronic circuits.
650 0 _aMicrotechnology.
650 0 _aMicroelectromechanical systems.
650 1 4 _aElectronics and Microelectronics, Instrumentation.
650 2 4 _aElectronic Circuits and Systems.
650 2 4 _aMicrosystems and MEMS.
710 2 _aSpringerLink (Online service)
773 0 _tSpringer Nature eBook
776 0 8 _iPrinted edition:
_z9789811999161
776 0 8 _iPrinted edition:
_z9789811999185
776 0 8 _iPrinted edition:
_z9789811999192
856 4 0 _zLibro electrónico
_uhttp://libcon.rec.uabc.mx:2048/login?url=https://doi.org/10.1007/978-981-19-9917-8
912 _aZDB-2-ENG
912 _aZDB-2-SXE
942 _cLIBRO_ELEC
999 _c261486
_d261485