000 | 03052nam a22005535i 4500 | ||
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001 | 978-981-19-9917-8 | ||
003 | DE-He213 | ||
005 | 20240207153555.0 | ||
007 | cr nn 008mamaa | ||
008 | 230327s2023 si | s |||| 0|eng d | ||
020 |
_a9789811999178 _9978-981-19-9917-8 |
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050 | 4 | _aTK7800-8360 | |
072 | 7 |
_aTJF _2bicssc |
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072 | 7 |
_aTEC008000 _2bisacsh |
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072 | 7 |
_aTJF _2thema |
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082 | 0 | 4 |
_a621.381 _223 |
100 | 1 |
_aLau, John H. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut |
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245 | 1 | 0 |
_aChiplet Design and Heterogeneous Integration Packaging _h[electronic resource] / _cby John H. Lau. |
250 | _a1st ed. 2023. | ||
264 | 1 |
_aSingapore : _bSpringer Nature Singapore : _bImprint: Springer, _c2023. |
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300 |
_aXXII, 525 p. 543 illus., 501 illus. in color. _bonline resource. |
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336 |
_atext _btxt _2rdacontent |
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337 |
_acomputer _bc _2rdamedia |
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338 |
_aonline resource _bcr _2rdacarrier |
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347 |
_atext file _bPDF _2rda |
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500 | _aAcceso multiusuario | ||
505 | 0 | _aState-of-the-Art of Advanced Packaging -- Chip Partition and Chip Split -- Multiple System and Heterogeneous Integration with TSV Interposers -- Multiple System and Heterogeneous Integration with TSV-Less Interposers -- Chiplets Lateral (Horizontal) Communications -- Cu-Cu Hybrid Bonding. | |
520 | _aThe book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc. | ||
541 |
_fUABC ; _cPerpetuidad |
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650 | 0 | _aElectronics. | |
650 | 0 | _aElectronic circuits. | |
650 | 0 | _aMicrotechnology. | |
650 | 0 | _aMicroelectromechanical systems. | |
650 | 1 | 4 | _aElectronics and Microelectronics, Instrumentation. |
650 | 2 | 4 | _aElectronic Circuits and Systems. |
650 | 2 | 4 | _aMicrosystems and MEMS. |
710 | 2 | _aSpringerLink (Online service) | |
773 | 0 | _tSpringer Nature eBook | |
776 | 0 | 8 |
_iPrinted edition: _z9789811999161 |
776 | 0 | 8 |
_iPrinted edition: _z9789811999185 |
776 | 0 | 8 |
_iPrinted edition: _z9789811999192 |
856 | 4 | 0 |
_zLibro electrónico _uhttp://libcon.rec.uabc.mx:2048/login?url=https://doi.org/10.1007/978-981-19-9917-8 |
912 | _aZDB-2-ENG | ||
912 | _aZDB-2-SXE | ||
942 | _cLIBRO_ELEC | ||
999 |
_c261486 _d261485 |