| 000 | 00843 a2200241 4500 | ||
|---|---|---|---|
| 003 | MX-MeUAM | ||
| 005 | 20240917092959.0 | ||
| 008 | 240917s2021 si ado fr 00| 0 eng d | ||
| 020 | _a9789811570926 | ||
| 040 |
_bspa _cMX-MeUAM |
||
| 050 | 4 |
_aTK7867 _bM5218 2021 |
|
| 245 | 0 | 0 |
_a3D microelectronic packaging : _bfrom architectures to applications / _cYan li, Deepak Goyal editors. |
| 250 | _a2dn ed. | ||
| 260 |
_aSingapur : _bSpringer Nature, _c2021 |
||
| 300 |
_axvii, 622 p. : _bil., diagramas, gráficas, fot. ; _c24 cm. |
||
| 490 | 0 |
_aSpringer series in advanced microelectronics ; _v64 |
|
| 504 | _aIncluye referencias bibliográficas (p. 615-617). | ||
| 650 | 7 |
_2lemb _aBiotecnología. |
|
| 650 | 7 |
_2lemb _aCircuitos electrónicos. |
|
| 700 | 1 |
_935905 _aLi, Yan _eed. |
|
| 700 | 1 |
_935910 _aDeepak, Goyal _eed. |
|
| 942 | _cLIBRO | ||
| 999 |
_c265801 _d265800 |
||