000			02938nam a22005535i 4500
001			978-981-97-2140-5
003			DE-He213
005			20250516160038.0
007			cr nn 008mamaa
008			240523s2024 si | s |||| 0|eng d
020			_a9789819721405 _9978-981-97-2140-5
050		4	_aTK7800-8360
072		7	_aTJF _2bicssc
072		7	_aTEC008000 _2bisacsh
072		7	_aTJF _2thema
082	0	4	_a621.381 _223
100	1		_aLau, John H. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut
245	1	0	_aFlip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology _h[electronic resource] / _cby John H. Lau.
250			_a1st ed. 2024.
264		1	_aSingapore : _bSpringer Nature Singapore : _bImprint: Springer, _c2024.
300			_aXX, 501 p. 556 illus., 520 illus. in color. _bonline resource.
336			_atext _btxt _2rdacontent
337			_acomputer _bc _2rdamedia
338			_aonline resource _bcr _2rdacarrier
347			_atext file _bPDF _2rda
505	0		_a -- Flip Chip Technology -- Cu-Cu Hybrid Bonding -- Fan-In Technology -- Fan-Out Technology -- Chiplet Communications (Bridges) -- Co-Packaged Optics.
520			_aThis book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics. The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc.
541			_fUABC ; _cPerpetuidad
650		0	_aElectronics.
650		0	_aSolid state physics.
650		0	_aLasers.
650		0	_aOptics.
650	1	4	_aElectronics and Microelectronics, Instrumentation.
650	2	4	_aElectronic Devices.
650	2	4	_aLaser Technology.
650	2	4	_aOptics and Photonics.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer Nature eBook
776	0	8	_iPrinted edition: _z9789819721399
776	0	8	_iPrinted edition: _z9789819721412
776	0	8	_iPrinted edition: _z9789819721429
856	4	0	_zLibro electrónico _uhttp://libcon.rec.uabc.mx:2048/login?url=https://doi.org/10.1007/978-981-97-2140-5
912			_aZDB-2-ENG
912			_aZDB-2-SXE
942			_cLIBRO_ELEC
999			_c275112 _d275111