Chiplet Design and Heterogeneous Integration Packaging
Lau, John H.
Chiplet Design and Heterogeneous Integration Packaging [electronic resource] / by John H. Lau. - 1st ed. 2023. - XXII, 525 p. 543 illus., 501 illus. in color. online resource.
Acceso multiusuario
State-of-the-Art of Advanced Packaging -- Chip Partition and Chip Split -- Multiple System and Heterogeneous Integration with TSV Interposers -- Multiple System and Heterogeneous Integration with TSV-Less Interposers -- Chiplets Lateral (Horizontal) Communications -- Cu-Cu Hybrid Bonding.
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
9789811999178
Electronics.
Electronic circuits.
Microtechnology.
Microelectromechanical systems.
Electronics and Microelectronics, Instrumentation.
Electronic Circuits and Systems.
Microsystems and MEMS.
TK7800-8360
621.381
Chiplet Design and Heterogeneous Integration Packaging [electronic resource] / by John H. Lau. - 1st ed. 2023. - XXII, 525 p. 543 illus., 501 illus. in color. online resource.
Acceso multiusuario
State-of-the-Art of Advanced Packaging -- Chip Partition and Chip Split -- Multiple System and Heterogeneous Integration with TSV Interposers -- Multiple System and Heterogeneous Integration with TSV-Less Interposers -- Chiplets Lateral (Horizontal) Communications -- Cu-Cu Hybrid Bonding.
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
9789811999178
Electronics.
Electronic circuits.
Microtechnology.
Microelectromechanical systems.
Electronics and Microelectronics, Instrumentation.
Electronic Circuits and Systems.
Microsystems and MEMS.
TK7800-8360
621.381
