Chiplet Design and Heterogeneous Integration Packaging [electronic resource] / by John H. Lau.

Por: Lau, John H [author.]Colaborador(es): SpringerLink (Online service)Tipo de material: TextoTextoEditor: Singapore : Springer Nature Singapore : Imprint: Springer, 2023Edición: 1st ed. 2023Descripción: XXII, 525 p. 543 illus., 501 illus. in color. online resourceTipo de contenido: text Tipo de medio: computer Tipo de portador: online resourceISBN: 9789811999178Tema(s): Electronics | Electronic circuits | Microtechnology | Microelectromechanical systems | Electronics and Microelectronics, Instrumentation | Electronic Circuits and Systems | Microsystems and MEMSFormatos físicos adicionales: Printed edition:: Sin título; Printed edition:: Sin título; Printed edition:: Sin títuloClasificación CDD: 621.381 Clasificación LoC:TK7800-8360Recursos en línea: Libro electrónicoTexto
Contenidos:
State-of-the-Art of Advanced Packaging -- Chip Partition and Chip Split -- Multiple System and Heterogeneous Integration with TSV Interposers -- Multiple System and Heterogeneous Integration with TSV-Less Interposers -- Chiplets Lateral (Horizontal) Communications -- Cu-Cu Hybrid Bonding.
En: Springer Nature eBookResumen: The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
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State-of-the-Art of Advanced Packaging -- Chip Partition and Chip Split -- Multiple System and Heterogeneous Integration with TSV Interposers -- Multiple System and Heterogeneous Integration with TSV-Less Interposers -- Chiplets Lateral (Horizontal) Communications -- Cu-Cu Hybrid Bonding.

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

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